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Resin material formula of halogen-free CEM-1 composite base material copper-clad laminate

A technology of composite substrate and resin material, applied in the field of copper clad laminate manufacturing, can solve the problems of poor heat dissipation performance, single resin material, unfavorable use, etc., and achieve the effect of good heat dissipation performance, saving resources and costs, and improving safety.

Inactive Publication Date: 2017-05-17
金宝电子(铜陵)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, the resin material used in the halogen-free CEM-1 composite substrate copper-clad laminate is single, and the heat dissipation performance is very poor, which is not conducive to use

Method used

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Embodiment Construction

[0012] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail in combination with examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0013] The resin material formula of the halogen-free CEM-1 composite substrate copper-clad laminate includes: 15-30 parts of polyethylene resin, 12-20 parts of furan resin, 2-5 parts of silicone resin, 1- 3 parts, 6-10 parts of maleic anhydride grafted polyethylene, 0.5-1 parts of calcium chloride powder, 1-2 parts of aminopropyltriethoxysilane, 10-20 parts of phenolic-polyvinyl acetal, iso Propyl dioleate acyloxy (dioctyl phosphate acyloxy) titanate 12-24 parts, methyl triethoxysilane 2-3 parts and cross-linking agent 3-6 parts, the above materials are prepared according to the formula After mixing, it is melted at a high temperature...

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Abstract

The invention relates to a resin material formula of a halogen-free CEM-1 composite base material copper-clad laminate, which comprises the following components in parts by weight: 15 to 30 parts of polyethylene resin, 12 to 20 parts of furan resin, 2 to 5 parts of organic silicon resin, 1 to 3 parts of ammonium bicarbonate, 6 to 10 parts of maleic anhydride grafted polyethylene, 0.5 to 1 part of calcium chloride powder, 1 to 2 parts of aminopropyltriethoxysilane, 10 to 20 parts of phenolic-polyvinyl acetal, 12 to 24 parts of isopropyl dioleate acyloxy (dioctylphosphoryloxy) titanate, 2 to 3 parts of methyl triethoxysilane and 3 to 6 parts of cross-linking agent. The materials are sufficiently mixed according to a proportion; after mixing, high-temperature melting is carried out, a mixture in a molten state is poured into a platy structure; the platy structure is cooled to obtain the halogen-free CEM-1 composite base material copper-clad laminate.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a resin material formula for a halogen-free CEM-1 composite substrate copper-clad laminate. Background technique [0002] Aluminum-based copper-clad laminate, that is, aluminum substrate, is a kind of raw material. It is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, single resin, etc. And a plate-like material made is called copper-clad laminated aluminum substrate, or aluminum-based copper-clad laminate for short. [0003] As the substrate material in the manufacture of printed circuit boards, aluminum-based copper-clad laminates mainly play the role of interconnection, conduction, insulation and support for printed circuit boards, and have a great impact on the transmission speed, energy loss and characteristic impedance of signals in the circuit. The performance, quality, processability, manufacturing l...

Claims

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Application Information

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IPC IPC(8): C08L23/06C08L61/00C08L83/04C08L51/06C08L29/14C08K13/02C08K3/16C08K5/544C08K5/5419
CPCC08L23/06C08L2205/035C08L61/00C08L83/04C08L51/06C08L29/14C08K13/02C08K2003/162C08K5/544C08K5/5419
Inventor 张家树
Owner 金宝电子(铜陵)有限公司