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One-component epoxy resin adhesive capable of delaying curing

An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of inability to cure, and achieve the effect of rapid curing and simple production requirements

Inactive Publication Date: 2017-05-31
HANGZHOU BAOMING NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the problem in the prior art that cannot be cured due to the fact that the adhered substrate is not transparent to ultraviolet light

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Mix the following raw materials evenly: ACE MX 153 (rubber toughened bisphenol A glycidyl ether epoxy resin, Kaneka Company) 75.2g, XY691 (o-cresyl glycidyl ether, Anhui Xinyuan Chemical Co., Ltd.) 20.8g, UVI- 6976 (triarylsulfonium hexafluoroantimonate in propylene carbonate solvent, 50wt%, Dow Chemical Company) 3.0g, Z-6040 ((3-epoxypropyl propoxy) trimethoxysilane, Dowcorning Company) 1.0 g. Sizing the mixed raw materials on the standard PC (polycarbonate) strip, using LED lamp (365nm, curing energy is 2000mJ / cm 2 ) after irradiating, wait for 30 seconds and then attach the standard PC (polycarbonate) sample, and test the shear strength after curing at room temperature for 1 hour.

Embodiment 2

[0023] Mix the following raw materials evenly: Epotuf 37-151 (bisphenol A glycidyl ether type epoxy resin, Reichhold Company) 59.0g, XY632 (1,6-hexanediol diglycidyl ether, Anhui Xinyuan Chemical Co., Ltd.) 35.0g g, UVI-6992 (triphenylsulfuric acid hexafluorophosphate in propylene carbonate solvent, 45wt%, Dow Chemical Company) 4.0g, UVR 6000 (3-ethyl-3-propylene oxide methanol, Shanghai Jinrui Industry and Trade Co., Ltd.) 2.0g. Sizing the mixed raw materials on the standard PC (polycarbonate) strip, using LED lamp (365nm, curing energy is 2000mJ / cm 2 ) after irradiating, wait for 1 minute and then attach standard PC (polycarbonate) strips, and test the shear strength after curing at room temperature for 1 hour.

Embodiment 3

[0025] Mix the following raw materials evenly: KEC 2190 (o-cresol aldehyde type glycidyl ether epoxy resin, Kolon company) 71.2g, XY690 (phenyl glycidyl ether, Anhui Xinyuan Chemical Co., Ltd.) 20.8g, UVI-6976 (hexafluoro Triarylsulfonium antimonate in propylene carbonate solvent, 50 wt%, Dow Chemical Company) 7.0 g, Z-6040 ((3-epoxypropylpropoxy) trimethoxysilane, Dowcorning Company) 1.0 g. Sizing the mixed raw materials on the standard PC (polycarbonate) strip, using LED lamp (365nm, curing energy is 2000mJ / cm 2 ) after irradiating, wait for 2 minutes and then attach standard PC (polycarbonate) strips, and test the shear strength after curing at room temperature for 1 hour.

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PUM

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Abstract

The invention discloses a one-component epoxy resin adhesive capable of delaying curing. The epoxy resin adhesive is prepared from the following components in parts by mass: 40.0-85.0 parts of epoxy resin, 0.1-30.0 parts of a reactive diluent, 0.5-8.0 parts of a photoinitiator and 0.1-10 parts of an adhesion promoter. The epoxy resin adhesive capable of delaying curing can be applied onto the surface of a base material to be adhered in advance, and is activated by ultraviolet irradiation; then, a base material to be adhered is stuck on the other side of the epoxy resin adhesive, and the activated adhesive can be cured at the room temperature; therefore, the two base materials to be adhered are stuck together. The ultraviolet activation stage of the adhesive is before the sticking of the base materials, so that the problem that the base materials to be adhered can not be crude due to being not transparent to ultraviolet light can be solved; furthermore, the adhesive is activated by relying on the ultraviolet light, thus being stored at the conventional storage temperature and the conventional humidity.

Description

technical field [0001] The invention relates to the technical field of epoxy resin adhesives, in particular to a delayed curing one-component epoxy resin adhesive. Background technique [0002] UV-curable adhesives have some notable features such as fast curing, high body strength, and strong adhesion, so they are widely used in the electronics industry, industrial fields and other fields. However, the curing of UV-curable adhesives also has certain limitations: 1. Some substrates cannot transmit purple light (such as opaque substrates, transparent substrates containing UV absorbers, etc.), and the activity of UV-curable adhesives is difficult to be stimulated. , so that it cannot be cured; 2. Some substrates are shaped, and the light in the shadow area is difficult to reach, and it is impossible to complete the effective curing of ultraviolet light. [0003] Aiming at the difficulty of curing caused by the inability of ultraviolet light to reach effectively, existing solut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C08G59/20C08G59/22
CPCC09J163/00C08G59/20C08G59/22C08K5/5435C09J11/06
Inventor 李志明陈倩倩林江滨
Owner HANGZHOU BAOMING NEW MATERIAL TECH CO LTD
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