High-voltage planar switch structure based on flexible manufacturing process and preparation method of structure

Abstract

The invention discloses a high-voltage planar switch structure based on a flexible manufacturing process and a preparation method of the structure. The high-voltage planar switch structure comprises a positive electrode plate, a negative electrode plate and a signal input electrode plate. The positive electrode plate comprises a positive electrode plate insulating substrate and a positive electrode. The negative electrode plate comprises a negative electrode plate insulating substrate and a negative electrode. The signal input electrode plate comprises an exploding foil insulating substrate, an exploding foil positive electrode and an exploding foil negative electrode, wherein the exploding foil positive electrode corresponds to the exploding foil negative electrode. The negative electrode plate, the signal input electrode plate and the positive electrode plate are vertically laminated to form the high-voltage planar switch structure, the positive electrodes and the negative electrodes are spatially intersected, the positive electrode plate is separated from the negative electrode plate by the insulating substrates, and a connecting line between the exploding foil positive electrode and the exploding foil negative electrode passes the intersection. A high-voltage planar switch is prepared by a flexible printed circuit board process, the size of the high-voltage planar switch structure is reduced, the structure and other devices are integrated, and response of the switch is rapider as plasma generated by electric explosion breaks down an insulating medium.

Description

technical field [0001] The invention relates to the fields of pyrotechnics technology and pulse power technology, in particular to a high-voltage planar switch structure based on a flexible manufacturing process and a preparation method thereof. Background technique [0002] In the field of pyrotechnics technology and pulse power technology, the planar switch is different from the traditional three-dimensional gas spark gap switch and vacuum switch. It has the characteristics of miniaturization and miniaturization, which can reduce the system volume and facilitate the integration of switches and other devices. In 2006, Wang Guiji et al. published a paper titled "Development and Performance Test of Planar Spark Gap Three-Electrode Switch", and proposed to process positive and negative electrodes and electric heaters on polymethyl methacrylate substrates, in which the positive and negative electrodes are made of stainless steel. And brass, the electric heater is copper-tungste...

AI Technical Summary

Problems solved by technology

In 2006, Wang Guiji and others published a paper titled "Development and Performance Test of Planar Spark Gap Three-Electrode Switch", which proposed to process positive and negative electrodes and electric heaters on polymethyl methacrylate substrates, in which the positive and negative electrodes were made of stainless steel And brass, the electric heater is copper-tungsten alloy, but this kind of switch has a large volume, which is not easy to integrate with other devices, and the inductance of the access circuit is large, which will greatly weaken the peak value of the discharge current effect

Usually, in order to ensure the current-carrying capacity of the switch, the designed switch needs to work in a certain gas atmosphere, the working voltage range is more limited, and it is easily affected by strong vibration and strong electromagnetic radiation environment, and the actual use is limited.

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