Hemispheric finishing grinding wheel for ultra-precision machining

An ultra-precision machining and hemispherical technology, which is applied in the direction of bonded grinding wheels, metal processing equipment, manufacturing tools, etc., can solve the problems that grinding cannot achieve free-form surface finishing, surface roughness is difficult to achieve, and polishing processing efficiency is low. The effect of improving finishing efficiency, practical mechanical structure and low cost of use

Active Publication Date: 2017-06-20
吉林省神农氏机器人科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the defects that in the actual production, the unavoidable polishing efficiency of the finishing process is low, the grinding can not realize the free-form surface finishing, the system is complex and expensive, and the surf

Method used

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  • Hemispheric finishing grinding wheel for ultra-precision machining
  • Hemispheric finishing grinding wheel for ultra-precision machining
  • Hemispheric finishing grinding wheel for ultra-precision machining

Examples

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Example Embodiment

[0018] Specific embodiment 1: A hemispherical smoothing grinding wheel for ultra-precision machining of this embodiment is specifically composed of an abrasive layer 1, a grinding wheel base 2 and a grinding wheel support 3 as figure 1 Shown

[0019] The grinding wheel base 2 is composed of a hemisphere 2-1, a fixed plate 2-2 and a positioning hole 2-3 Figure 3a As shown in and b, the hemisphere 2-1 is arranged on the fixing plate 2-2, and a positioning hole 2-3 with a radius r and a depth smaller than the thickness of the fixing plate is arranged at the center of the fixing plate 2-2;

[0020] The grinding wheel support 3 is composed of a positioning boss 3-1, a support plate 3-2 and a grinding wheel rod 3-3;

[0021] The positioning boss 3-1 is located at the center of the upper end of the support plate 3-2, the grinding wheel rod 3-3, the positioning boss 3-1 and the support plate 3-2 are coaxial, and the grinding wheel rod 3-3 is used to support the support plate 3. -2 as Figu...

Example Embodiment

[0025] Specific embodiment two: this embodiment is different from specific embodiment one in that: the thickness of the abrasive layer 1 ranges from 5 to 10 mm; the abrasive layer 1 is composed of abrasives and bonding agents, wherein the abrasives are diamond or cubic nitride One of boron, silicon carbide or corundum, and the type of bonding agent is one of metal, ceramic or resin. Other steps and parameters are the same as in the first embodiment.

Example Embodiment

[0026] Specific embodiment three: This embodiment is different from specific embodiment one or two in that: the adhesive used for the bonded abrasive layer 1 and the hemisphere 2-1, the fixing plate 2-2 is bonded to the supporting plate 3- 2 Adhesives used and bonding of the fixing plate 2-2 and the support plate 3-2 The adhesives used are high temperature resistant adhesives, among which the high temperature resistant adhesives are high temperature resistant epoxy adhesives or high temperature resistant phenolic resin adhesives. Other steps and parameters are the same as those in the first or second embodiment.

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Abstract

The invention relates to a hemispheric finishing grinding wheel, in particular to a hemispheric finishing grinding wheel for ultra-precision machining. The hemispheric finishing grinding wheel solves the inevitable problems that in actual production, polishing and machining efficiency of a finishing process is low, and free-form surface finishing cannot be achieved through grinding, a system is complex and expansive, the surface roughness obtained after surface finishing is hard to reach ultra-precision accuracy, and wide application to ultra-precision machining of a hemispheric optical element is difficult. The grinding wheel is composed of a grinding material layer, a grinding wheel base and a grinding wheel supporting piece, and the grinding wheel base is composed of a hemispheric body, a fixing plate and a positioning hole; and the grinding wheel supporting piece is composed of a positioning boss, a supporting plate and a grinding wheel rod. The structure is applied to the field of hemispheric finishing grinding wheel.

Description

technical field [0001] The invention relates to a hemispherical smoothing grinding wheel, in particular to a hemispherical smoothing grinding wheel for ultra-precision machining. Background technique [0002] At present, the demand for aspheric optical components is becoming more and more urgent in the fields of aerospace, medical, astronomy and modern optoelectronic products. From the perspective of machining, aspheric optical elements have the characteristics of high material hardness, complex surface shape, high geometric precision and high finish, which have become a technical problem in the field of ultra-precision machining. As the last process in ultra-precision machining, finishing is an important link in determining the surface roughness and smoothness of aspheric components. The traditional finishing process is polishing or grinding. In actual production, there are defects that the finishing process inevitably has low polishing efficiency and grinding cannot achie...

Claims

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Application Information

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IPC IPC(8): B24B13/01B24D7/18
CPCB24B13/01B24D7/18
Inventor 顾兴士郭兵王金虎张春雨赵清亮
Owner 吉林省神农氏机器人科技有限公司
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