Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes
An electrodeless and catalyst technology, applied in printed circuit, printed circuit manufacturing, physical/chemical process catalyst, etc.
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example 1
[0047] Synthesis of starch / silver catalyst with glucose as reducing agent
[0048] The starch / silver catalyst was prepared by dissolving 6 g / L starch in a beaker containing 900 mL DI water with heating at 50°C to 55°C. Make 50g / L starch solution. Add 472 mg of silver nitrate to 50 mL of DI water and stir until completely dissolved. The mixture was added to the solution and stirred vigorously while heating continuously. The pH was adjusted to 9-13 and 100 mg of glucose was dissolved in 20 mL of DI water and the solution mixture was stirred very vigorously. The solution rapidly changed from colorless to reddish brown, indicating reduction of silver ions to silver metal. The final volume was then adjusted to one liter. The solution pH was readjusted with inorganic or organic acid and the catalyst thus synthesized had a pH of 5 to 10 as measured using an ACCUMET AB15 pH meter. The beaker containing the aqueous catalyst solution was placed in a 50°C water bath for about 12 hou...
example 2
[0050] Electroless Copper Plating
[0051] The catalyst solution prepared in Example 1 was used as a stock solution and 2 aliquots were diluted with DI water to a nanoparticle concentration of 250 ppm. The pH of the aliquots was adjusted to 3 or 5 with ascorbic acid. The weight ratio of dextrin to reducing agent is about 60:1.
[0052] 3% b.v. CIRCUPOSIT for two bare laminate test pieces measuring 10cm x 5cm TM Conditioner 231 was conditioned and rinsed with tap water at room temperature. Each coupon was then submerged in one of the two aliquots containing the dextrin / silver catalyst for about 5 minutes to pre-coat each coupon with the catalyst. During the catalysis, the aqueous catalyst bath with the coupons was heated at a temperature of about 40°C. The catalyzed coupons were then immersed in CIRCUPOSIT at 36°C TM 880 for about 15 minutes in an electroless copper plating bath. The pH of the electroless copper plating bath is about 12.
[0053] The coupons were remove...
example 3
[0055] Through Hole Plating
[0056] Six different laminates with multiple through holes are available: NP-175, 370HR, TUC-752, SY-1141, SY-1000-2 and FR-408. NP-175 was from Nan Ya. 370HR and FR4-408 are from Isola. TUC-752 was from Taiwan Union Technology and SY-1141 and SY-1000-2 were from Shengyi. Laminate T g The values are in the range of 140°C to 180°C. Each laminate is 5cm x 12cm. The via processing for each laminate is as follows:
[0057] 1. Use CIRCUPOSIT for each laminate through-hole TM MLB conditioner 211 removes scum at 78°C for 7 minutes;
[0058] 2. The through holes of each laminate were then rinsed with running tap water for 4 minutes;
[0059] 3. Through hole followed by CIRCUPOSIT at 78°C at a pH of 13 TM MLB accelerator 213 aqueous permanganate solution for 10 minutes;
[0060] 4. The through hole is then rinsed in running tap water for 4 minutes;
[0061] 5. Via followed by CIRCUPOSIT at 46°C TM MLB neutralizer 216-5 solution for 5 minut...
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