A multi-layer power divider upper and lower microstrip circuit connection structure

Abstract

The present invention provides an up-down layer microstrip circuit connection structure of a multilayer power divider. The structure comprises an upper-layer microstrip circuit (1), a lower-layer microstrip circuit (2), a floor (3), a metal conducting post (4) and redundant copper-layer circuits (5). The over-metallizing via hole of the metal conducting post (4) passes through the upper-layer microstrip circuit (1), the floor (3) and the lower-layer microstrip circuit (2), the redundant copper-layer circuit (5) is added at the connection of the upper-layer microstrip circuit (1) and the metal conducting post (4), the redundant copper-layer circuit (5) is added at the connection between the lower-layer microstrip circuit (2) and the metal conducting post (4), and the redundant copper-layer circuits increase contact areas between the metal conducting post (4) and the upper-layer microstrip circuit (1) and between the metal conducting post (4) and the lower-layer microstrip circuit (2).

Description

technical field [0001] The invention belongs to the field of microwaves and antennas, and relates to a connection structure of upper and lower microstrip circuits of a multilayer power divider. Background technique [0002] A power divider (power splitter) is a multi-port microwave network that divides the input signal power into equal or unequal multiple outputs. The power splitter can be realized by a variety of transmission lines, the most commonly used are waveguide power splitter, coaxial line power splitter and microstrip line power splitter. The waveguide power splitter has the advantages of small loss and large power capacity. However, its transmission line structure determines that the waveguide power divider is not easy to integrate and the size is difficult to miniaturize. The advantage of the coaxial power splitter is large power capacity and low loss. The disadvantage is that the standing wave at the output end is relatively large and there is no isolation bet...

AI Technical Summary

Problems solved by technology

However, the existing processing technology is difficult to ensure the size of the metallized via hole on the soft dielectric board

When the radius of the metallized via is too large, the metallized via cannot be in good contact with the conductive column, which affects the performance of the power divider

When the radius of the metallized via is too small, when the metallized via is squeezed by the conductive column during the assembly process, the metal surface of the via becomes rough, resulting in enhanced circuit discontinuity, which increases the conduction loss of the power divider Big

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