A glass microstructure processing method

Abstract

The invention provides a glass microstructure processing method comprising the steps of adjusting the position of a glass part; processing the glass part by using picosecond laser layer-by-layer material removing processing technology; performing side surface trimming; performing repair on defect layers; performing ultrasonic etching by using a diluted hydrofluoric acid solution; performing deionized water rinsing and nitrogen drying. The picosecond laser layer-by-layer material removing technology is employed for processing glass part microstructures and one-time processing is performed on special shapes of glass parts, so that technological procedures of processing can be effectively simplified, the processing precision can be improved and error caused by multiple times of mask making and etching can be avoided. The method can effectively process transition zones of inclined surfaces of parts, so that the processing angles at the inclined surfaces are controllable; by reducing the viscosity of glass, subsurface layer damage and surface roughness caused in laser processing can be effectively reduced, so that the using properties of processed structures are improved; the diluted hydrofluoric acid solution is used for ultrasonic etching, so that the roughness of processed surfaces is further reduced and surface quality of glass parts processed with picosecond laser can be improved.

Description

technical field [0001] The invention relates to a glass microstructure processing method, which belongs to the technical field of optical instrument precision processing. Background technique [0002] Glass has good visible light transmittance and biocompatibility, so it is widely used in the fields of precision optical devices, instruments and meters, and biosensors. In the processing technology of glass parts, physical or chemical etching methods under the protection of masks are often used to form specific microstructures. With the development of science and technology, industries such as optics and electronics put forward higher requirements for the processing of glass parts. New devices require glass parts to have microstructures with complex patterns, multi-layer structures, and controllable angles of bevel transition zones. [0003] In the prior art, the glass microstructure is usually processed by physical or chemical etching under the protection of a patterned mas...

AI Technical Summary

Problems solved by technology

However, the surface roughness of picosecond laser processing is large, and there are microcrack damage and stress layers in the subsurface layer, which affect the performance of glass microstructures in devices, such as the material transport performance in glass microchannels, etc.

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