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Heat-conductive radiating coating

A heat-dissipating coating and heat-dissipating material technology, which is applied in the direction of epoxy resin coating, polyurea/polyurethane coating, coating, etc., can solve the problems of increasing equipment volume, equipment performance degradation, and burning out equipment, so as to improve heat dissipation efficiency and use Convenience and good effect

Inactive Publication Date: 2017-07-07
DONGGUAN WANFENG NANOMETER MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These devices will emit a lot of heat during use. If the heat cannot be dissipated in time, the performance of the device will decrease or even overheating will cause the device to burn out.
For example, when a mobile phone uses a certain high-performance CPU, serious phenomena such as CPU frequency reduction, freezing or even restarting often occur after opening games or other software; laptops may freeze when playing large-scale games or drawing pictures, etc. Phenomenon; when the desktop computer burns CDs or uses professional software such as CAD and Photoshop, there will be phenomena such as freezing and restarting; these are caused by one or both of the CPU (central processing unit) or GPU (display core) being overheated at the same time As a result, the overheating protection program designed by the chip designer - frequency reduction and restart
[0003] In order to solve the above-mentioned problems, some devices are equipped with cooling devices such as fans, such as desktop computers. However, the installation of fans cannot completely solve the overheating protection program of the device due to overheating. In addition, the installation of fans also increases the volume of the device, which is different from Computers are becoming thinner and lighter, and some small devices or components cannot be installed with fans

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Preparation materials: MDI5011.88g, long-chain saturated polyether diol A120g, organotin 0.673g, toluene: 31.88g.

[0021] Take 120g of long-chain saturated polyether diol A, 31.88g of toluene and 0.673g of organotin, heat up to 70°C in a nitrogen atmosphere, slowly add MDI5011.88g in a constant pressure funnel, start timing after adding MDI50, and react for 3 hours The reaction was stopped to obtain a hydroxyl-terminated PU protoplasm with a molecular weight of about 15,000. Dilute the PU puree to a solid content of 5%-50%, add nano-modified mica powder, ALN powder, BN powder, SiO2 powder, nano-modified graphite and additives to disperse in a high-speed disperser to obtain a stable solid content 40% black heat-conducting heat-dissipating paint. The auxiliary agent is one of thixotropic agent, antiaging agent, defoamer, dispersant, coupling agent, tackifier or a mixture thereof. It is necessary to add an appropriate amount of curing agent when coating. Wherein the cu...

Embodiment 2

[0024] Preparation materials: HDI1001.584g, long-chain saturated polyether diol A240g, organotin 0.673g, cyclohexane: 27.72g.

[0025] Take 220g of long-chain saturated polyether diol A, 27.72g of cyclohexane and 0.673g of organotin, raise the temperature to 70°C in a nitrogen atmosphere, slowly add HDI1001.584g in a constant pressure funnel, and start timing after adding HDI100, the reaction After 3 hours, the reaction was stopped to obtain a hydroxyl-terminated PU puree with a molecular weight of about 50,000. Dilute the PU puree to a solid content of 5%-50%, add nano-modified mica powder, ALN powder, BN powder, SiO2 powder, nano-modified graphite and additives to disperse in a high-speed disperser to obtain a stable solid content About 35% black heat dissipation paint. It is necessary to add an appropriate amount of curing agent when coating. Wherein the curing agent can be isocyanate and amine curing agent.

[0026] Apply this heat-conducting and heat-dissipating coatin...

Embodiment 3

[0028] Preparation materials: MDI1009.75g, long-chain saturated polyether triol A340g, organic bismuth 0.673g, ethyl acetate: 12.44g

[0029] Take 340g of long-chain saturated polyether triol A, 12.44g of ethyl acetate and 0.673g of organic bismuth, raise the temperature to 70°C in a nitrogen atmosphere, slowly add MDI1009.75g into the constant pressure funnel, and start timing after adding HDI100, the reaction After 3 hours, the reaction was stopped to obtain a hydroxyl-terminated PU puree with a molecular weight of about 50,000. Dilute the PU puree to a solid content of 5%-50%, add about 10% epoxy resin, nano-modified mica powder, ALN powder, BN powder, SiO2 powder, nano-modified graphite and additives in a high-speed disperser Disperse to obtain a stable black heat-conducting and heat-dissipating coating with a solid content of about 35%. It is necessary to add an appropriate amount of curing agent when coating. Wherein the curing agent can be isocyanate and amine curing ...

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PUM

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Abstract

The invention relates to a heat-conductive radiating coating coated on an electronic element surface. The heat-conductive radiating coating is prepared from the following materials by weight percent: 10%-30% of a base material, 5%-69% of a heat-conductive radiating material, 20%-70% of a solvent and 1%-20% of an additive. The heat-conductive radiating coating provided by the invention has convenience in use; when the heat-conductive radiating coating is coated on the to-be-radiated elements, such as, copper foil and radiator, the radiating efficiency can be increased and the volume of the product is not increased; the effect is excellent; the radiating efficiency can be increased by 20%-40%.

Description

technical field [0001] The invention relates to a heat-conducting and heat-dissipating material, in particular to a heat-conducting and heat-dissipating paint coated on the surface of an electronic component. Background technique [0002] At present, mobile phones, notebooks, LEDs, desktop computers, various chargers and high-power equipment all involve structural design of heat conduction and heat dissipation. These devices will emit a lot of heat during use. If the heat cannot be dissipated in time, the performance of the device will decrease or even overheating will cause the device to burn out. For example, when a mobile phone uses a certain high-performance CPU, serious phenomena such as CPU frequency reduction, freezing or even restarting often occur after opening games or other software; laptops may freeze when playing large-scale games or drawing pictures, etc. Phenomenon; when the desktop computer burns CDs or uses professional software such as CAD and Photoshop, t...

Claims

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Application Information

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IPC IPC(8): C09D175/08C09D163/00C09D133/00C09D7/12C08G18/48C09D11/03C09D11/107C09D11/102
CPCC09D175/08C08G18/4825C08G18/4829C08K3/04C08K3/34C08K3/36C08K13/06C08K2003/282C08K2003/385C08K2201/011C09D7/61C09D7/62C09D11/03C09D11/102C09D11/107C09D163/00C08L33/00
Inventor 李金明
Owner DONGGUAN WANFENG NANOMETER MATERIALS
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