Metal Oxide Half Field Effect Transistor Power Device with Bottom Gate
A metal-oxygen semi-field and power component technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc. big problem
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[0032] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:
[0033] see Figure 1-Figure 9 As shown, it is a cross-sectional view of the manufacturing process of a metal oxide semiconductor field effect transistor power element with a bottom gate according to a preferred embodiment of the present invention. Such as figure 1 As shown, according to the present invention, a composite substrate 100 is firstly provided. This composite substrate 100 may include, for example, a highly doped N-type silicon substrate 101 (N+ silicon substrate) and a low-doped N-type epitaxial layer 102 (N- epitaxial layer). The low doping concentration N-type epitaxial layer 102 shown in this figure is thicker than the higher doping concentration N-type silicon substrate 101. However, it should be noted that this figure is only a schematic illustration of a specific example of the present invention. Therefor...
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