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Metal Oxide Half Field Effect Transistor Power Device with Bottom Gate

A metal-oxygen semi-field and power component technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc. big problem

Active Publication Date: 2020-07-07
广东普福斯节能元件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the device density increases, the charge between the gate and the drain (Qgd) will increase, which will slow down the charging and discharging speed of the gate and affect the performance of the device.

Method used

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  • Metal Oxide Half Field Effect Transistor Power Device with Bottom Gate
  • Metal Oxide Half Field Effect Transistor Power Device with Bottom Gate
  • Metal Oxide Half Field Effect Transistor Power Device with Bottom Gate

Examples

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Embodiment Construction

[0032] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0033] see Figure 1-Figure 9 As shown, it is a cross-sectional view of the manufacturing process of a metal oxide semiconductor field effect transistor power element with a bottom gate according to a preferred embodiment of the present invention. Such as figure 1 As shown, according to the present invention, a composite substrate 100 is firstly provided. This composite substrate 100 may include, for example, a highly doped N-type silicon substrate 101 (N+ silicon substrate) and a low-doped N-type epitaxial layer 102 (N- epitaxial layer). The low doping concentration N-type epitaxial layer 102 shown in this figure is thicker than the higher doping concentration N-type silicon substrate 101. However, it should be noted that this figure is only a schematic illustration of a specific example of the present invention. Therefor...

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Abstract

A metal oxide semiconductor field-effect transistor power element with a bottom gate, comprising: a substrate of a first conductivity type; an epitaxial layer of a first conductivity type located on the substrate of the first conductivity type; a plurality of device grooves set up On the upper surface of the first conductive type epitaxial layer, each device trench has a bottom gate, a separation gate and a trench gate arranged from deep to shallow, wherein the bottom gate and the first conductive There is a bottom insulating layer between the epitaxial layers, an intermediate insulating layer between the bottom gate and the separation gate, and an upper insulating layer between the separation gate and the ditch gate.

Description

technical field [0001] The invention relates to a metal oxide half field effect transistor power element, and further relates to a metal oxide half field effect transistor power element with a bottom gate. Background technique [0002] Metal Oxide Semiconductor Field Effect Transistor Power Device (Metal Oxide Semiconductor Field Effect Transistor Power Device) is generally referred to as a power transistor (Power MOSFET). It is a field effect transistor that can be widely used in analog circuits and digital circuits. It has become a power device ( The mainstream of Power device) is often used in many power electronics applications. MOS field effect transistor power devices have very low on-resistance and extremely large gate input impedance, so the power dissipation at the input end is quite small. Furthermore, compared with the power bipolar transistor (Power Bipolar Transistor), the MOSFET power element only has a single carrier and does not have the disadvantage of mino...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/78H01L21/336H01L29/423
CPCH01L29/4236H01L29/66484H01L29/7831H01L29/404H01L29/407H01L29/41766H01L29/7813
Inventor 陈冠宇李序恒陈美玲
Owner 广东普福斯节能元件有限公司