Heat radiation structural member with good comprehensive property and preparation process thereof
A heat dissipation structure and comprehensive performance technology, applied in heat exchange equipment, lighting and heating equipment, electrical equipment structural parts, etc., can solve the problems of large pollution, poor pressure resistance, poor explosion resistance, etc., and achieve simple preparation process, anti-knock Good anti-knock performance and reduced processing time
Active Publication Date: 2017-07-11
林进东
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Embodiment 1
[0041] This embodiment provides a heat dissipation structure with good comprehensive performance, such as figure 1 , figure 2 As shown, A board 100, B board 200, capillary function layer 300 and cooling liquid are provided.
[0042] A plate 100 , on the outer surface of the A plate 100 , a plurality of copper pillars 110 located on the inner surface of the A plate 100 and abutting against the A plate 100 are welded to the inner surface of the A plate 100 by welding.
[0043] Board B 200 is hermetically assembled with board A 100 and has grooves 210 that match the copper pillars 110 of board A 100. A plurality of copper pillars 110 of board A abut against the inner surface of the grooves 210 of board B. The outer surface of the board welds the inner surface of the B board to a plurality of abutting copper pillars 110 . The board A 100 is assembled with the board B 200 , the two ends of the copper pillar 110 are respectively connected with the board A 100 and the board B 200 ...
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Provided is a heat radiation structural member with good comprehensive property. The heat radiation structural member comprises an A board, a B board, a capillary function layer, and cooling liquid, a plurality of copper columns located on the inner surface of the A board and abutted against the A board are welded on the inner surface of the A board at the external surface of the A board through a welding mode, the B board and the A board are assembled in a sealing manner, the B board is provided with grooves matched with the copper columns of the A board, the plurality of copper columns of the A board are abutted against the inner surfaces of the grooves of the B board, and the inner surface of the B board and the abutted plurality of copper columns are welded through the external surface of the B board. The preparation process thereof includes: (1) welding the copper columns on the A board; (2) preparing the capillary function layer; (3) assembling the B board and the A board; (4) welding peripheries of the B board and the A board in a sealing manner to form a cavity structure; and (5) injecting the cooling liquid, performing vacuum pumping, and sealing a cooling liquid pipeline. According to the heat radiation structural member, the preparation is simple, the machining time is greatly reduced, the hardness of the integral heat radiation member is good, the anti-compression and anti-knock properties are excellent, the surface flatness is good, and the glossiness is good.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation structure with good comprehensive performance and a preparation process thereof. Background technique [0002] Good heat dissipation performance is an important guarantee to ensure the effective operation of electronic products. Electronic products usually use multi-layer sheet radiators made of aluminum or copper for heat dissipation. Some larger products are also cooled by liquids such as water or other cooling fluids. Heat dissipation, etc. However, with the gradual miniaturization of electronic products, the volume of the cooling device is required to be smaller and smaller. [0003] In the prior art, the structure of a heat sink with small volume and good heat dissipation performance is composed of two substrates to form a cavity, and the inner walls of the two substrates are respectively provided with a capillary function ...
Claims
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IPC IPC(8): H05K7/20B23P15/26
CPCB23P15/26H05K7/20336H01L23/473F28D15/0233F28F3/048F28F13/185F28F19/06H01L23/3677H01L23/3735H05K7/20
Inventor 林进东
Owner 林进东