Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method, preparation device and production line for preparing integrated heat dissipation structure which is used for sealing liquid metal through one step

A liquid metal and preparation device technology, which is applied in the direction of modification through conduction and heat transfer, cooling/ventilation/heating modification, etc., can solve problems such as liquid metal leakage, achieve easy processing, simplify processing procedures, and avoid liquid metal leakage.

Pending Publication Date: 2017-07-14
广东光钛领先新材料有限公司
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned technical problems in the prior art, the object of the present invention is to provide a preparation method, preparation device and production line for one-step preparation of an integrated heat dissipation structure for sealing liquid metal, and the integrated heat dissipation structure prepared by the preparation method and preparation device The heat dissipation structure not only solves the technical problem that liquid metal is prone to leakage, but also simplifies the preparation steps and equipment, which can realize automated mass production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method, preparation device and production line for preparing integrated heat dissipation structure which is used for sealing liquid metal through one step
  • Preparation method, preparation device and production line for preparing integrated heat dissipation structure which is used for sealing liquid metal through one step
  • Preparation method, preparation device and production line for preparing integrated heat dissipation structure which is used for sealing liquid metal through one step

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] A method for preparing an integrated heat dissipation structure for sealing liquid metal in one step, comprising the following steps:

[0055] (1) Dispensing:

[0056] Place the processed sealing frame 1 on a plane, and then drop liquid liquid metal 60 into the through hole 111;

[0057] The structure of the sealing frame 1 is as follows image 3 and Figure 4 As shown, it includes a frame body 11 that matches the shape of the heating element 20, and thermally conductive adhesive layers 12 that are respectively arranged on the two surfaces of the frame body 11. The sealed frame body is provided with a through hole 111 for filling the liquid metal 60, and the frame The body 11 is a frame body 11 made of corrosion-resistant and aging-resistant materials.

[0058] (2) The liquid metal 60 and the sealing frame 1 are integrally formed by die-casting process:

[0059] The die-casting process is used to die-cast the liquid metal 60 in the through hole 111 through the press...

Embodiment 2

[0076] The preparation device for the integrated heat dissipation structure for sealing liquid metal is prepared in one step. This embodiment adopts the preparation method of Embodiment 1. The structure of the sealing frame 1 is exactly the same as that of Embodiment 1.

[0077] Such as Figure 8 As shown, the preparation device includes a conveying mechanism, a dispensing mechanism 2, a die-casting mechanism 3 and a cooling mechanism 4, wherein: the conveying mechanism is a belt conveying mechanism, and the dispensing mechanism 2 includes a dispensing cylinder 21, a point communicated with the dispensing cylinder 21 The glue head 22 and the X-axis servo manipulator 23 that drives the dispensing head 22 to move along the X-axis direction, the Y-axis servo manipulator (not shown in the figure) that moves along the Y-axis direction, and the Z-axis servo manipulator 24 that moves along the Z-axis direction (See X-axis, Y-axis, Z-axis directions Figure 8 indicated direction). T...

Embodiment 3

[0082]A production line for preparing the integrated heat dissipation structure for sealing liquid metal in one step, including a preparation device for the integrated heat dissipation structure for sealing liquid metal and a sealing frame manufacturing device, wherein: one step is for preparing the integrated heat dissipation structure for sealing liquid metal The preparation device and preparation method of the structure are exactly the same as those in Example 2, and the structure of the sealing frame is exactly the same as that in Example 1, and will not be repeated in this example.

[0083] Such as Figure 9 As shown, in this embodiment, the sealing frame manufacturing device 5 includes an extruder 51, a calender 52, a gluing mechanism 53, and a cutting mechanism 54, wherein the corrosion-resistant and aging-resistant plastic raw materials pass through the extruder 51 and the calender in sequence. After 52, the sheet-like board is obtained. The glue-applying mechanism 53 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of heat dissipation of an electronic device and specifically relates to a preparation method, preparation device and production line for preparing an integrated heat dissipation structure which is used for sealing liquid metal through one step. According to the preparation method, the liquid metal and a sealing frame are integrally moulded through dispensing and die-casting molding, thereby forming the integrated heat dissipation structure. Compared with the prior art, the preparation method provided by the invention has the advantages that steps of independently processing a liquid metal sheet and manually coating the periphery of the liquid metal sheet with heat conductive paste or sealing glue are removed; the whole process and the device are greatly simplified; the production efficiency is improved; batch production can be carried out; the sizes of the sealing frame and a heat conductive glue layer can be controlled precisely; and the processing precision is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a preparation method, a preparation device and a production line for one-step preparation of an integrated heat dissipation structure for sealing liquid metal. Background technique [0002] With the advent of the intelligent era, electronic equipment such as communication equipment is increasingly moving towards miniaturization, thinner, and higher performance. Various electronic components (such as IGBT modules, CPUs, etc.) need to be configured in the limited space inside electronic equipment, and their integration and assembly density continue to increase. Due to the miniaturization and thinning of electronic equipment, it provides a powerful application At the same time, it also leads to a sharp increase in its power consumption and heat generation, which has a serious impact on the performance of electronic components. [0003] In the prior ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 童潇楚盛郑海鹏葛爱雄廖太明
Owner 广东光钛领先新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com