Technical glue for integrated motherboard
A process and motherboard technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of affecting the viscous effect, easy heating of the circuit, etc., to shorten the process time, improve quality, and improve efficiency effect
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Example Embodiment
[0039] Example 1
[0040] A process glue used for integrated motherboards. The process glue is AB two-component. According to the mass percentage, the A component includes the following components and proportions:
[0041] Acrylate or methacrylic acid 30%;
[0042] Defoamer 3%;
[0043] Thinner 3%;
[0044] Penetrant 0.3%;
[0045] Toughening agent 10%;
[0046] 30% filler;
[0047] Ammonia 0.01%;
[0048] Additive 0.1%;
[0049] According to the mass percentage ratio, component B includes the following components and proportions:
[0050] Butyl acrylate 15%;
[0051] Alicyclic amine 10%;
[0052] Polyetheramine 5%;
[0053] Thickener 0.3%;
[0054] Low molecular weight polyamide 3%;
[0055] Initiator 0.01%;
[0056] Additive 0.5%;
[0057] Filling 39%.
[0058] The A component and the B component are mixed in a weight ratio of 1:1.
[0059] The toughening agent is selected from one or a mixture of liquid epoxy acrylate, acetonitrile rubber, liquid carboxyl-terminated nitrile rubber or hydroxyethylpi...
Example Embodiment
[0063] Example 2
[0064] A process glue used for integrated motherboards. The process glue is AB two-component. According to the mass percentage, the A component includes the following components and proportions:
[0065] Acrylate or methacrylic acid 35%;
[0066] Antifoaming agent 8%;
[0067] Thinner 7%;
[0068] Penetrant 0.6%;
[0069] Toughening agent 12%;
[0070] Filling 37%;
[0071] Ammonia 0.05%;
[0072] Additive 0.4%;
[0073] According to the mass percentage ratio, component B includes the following components and proportions:
[0074] 20% butyl acrylate;
[0075] Alicyclic amine 15%;
[0076] Polyetheramine 10%;
[0077] Thickener 0.6%;
[0078] Low molecular weight polyamide 7%;
[0079] Initiator 0.2%;
[0080] Additive 1.0%;
[0081] Filling 49%.
[0082] The A component and the B component are mixed in a weight ratio of 1:2.
[0083] The toughening agent is selected from one or a mixture of liquid epoxy acrylate, acetonitrile rubber, liquid carboxyl-terminated nitrile rubber or hydr...
Example Embodiment
[0087] Example 3
[0088] A process glue used for integrated motherboards, said process glue is AB two-component, according to mass percentage, A component includes the following components and proportions:
[0089] Acrylate or methacrylic acid 45%;
[0090] Antifoaming agent 12%;
[0091] Thinner 10%;
[0092] Penetrant 0.9%;
[0093] Toughening agent 15%;
[0094] Filling 45%;
[0095] Ammonia 1%;
[0096] Additive 0.7%;
[0097] According to the mass percentage ratio, component B includes the following components and proportions:
[0098] Butyl acrylate 25%;
[0099] Alicyclic amine 20%;
[0100] Polyetheramine 15%;
[0101] Thickener 0.9%;
[0102] Low molecular weight polyamide 10%;
[0103] Initiator 0.5%;
[0104] Additive 1.7%;
[0105] Filling 59%.
[0106] The A component and the B component are mixed at a weight ratio of 2:1.
[0107] The toughening agent is selected from one or a mixture of liquid epoxy acrylate, acetonitrile rubber, liquid carboxyl-terminated nitrile rubber or hydroxyethy...
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