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Technical glue for integrated motherboard

A process and motherboard technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of affecting the viscous effect, easy heating of the circuit, etc., to shorten the process time, improve quality, and improve efficiency effect

Inactive Publication Date: 2017-08-01
合肥仁德电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] When the integrated circuit is in use, the circuit of the power supply part of the integrated motherboard is prone to heat, and a long time will affect the viscosity effect of the traditional craft glue

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A process glue for integrated main board, the process glue is AB two-component, according to the mass percentage, A component includes the following components and proportions:

[0041] Acrylate or methacrylic acid 30%;

[0042] Defoamer 3%;

[0043] Thinner 3%;

[0044] Penetrant 0.3%;

[0045] Toughener 10%;

[0046] Filler 30%;

[0047] Ammonia 0.01%;

[0048] Additive 0.1%;

[0049] According to the mass percentage ratio, component B includes the following components and proportions:

[0050] Butyl acrylate 15%;

[0051] Alicyclic amine 10%;

[0052] Polyetheramine 5%;

[0053] Thickener 0.3%;

[0054] Low molecular weight polyamide 3%;

[0055] Initiator 0.01%;

[0056] Additive 0.5%;

[0057] Filler 39%.

[0058] The A component and the B component are mixed in a weight ratio of 1:1.

[0059] The toughening agent is selected from one or a mixture of liquid epoxy acrylate, acetonitrile rubber, liquid carboxyl-terminated nitrile rubber or hydroxyethyl...

Embodiment 2

[0064] A process glue for integrated main board, the process glue is AB two-component, according to the mass percentage, A component includes the following components and proportions:

[0065] Acrylate or methacrylic acid 35%;

[0066] Defoamer 8%;

[0067] Thinner 7%;

[0068] Penetrant 0.6%;

[0069] Toughener 12%;

[0070] Filler 37%;

[0071] Ammonia 0.05%;

[0072] Additive 0.4%;

[0073] According to the mass percentage ratio, component B includes the following components and proportions:

[0074] Butyl acrylate 20%;

[0075] Alicyclic amine 15%;

[0076] Polyetheramine 10%;

[0077] Thickener 0.6%;

[0078] Low molecular weight polyamide 7%;

[0079] Initiator 0.2%;

[0080] Additive 1.0%;

[0081] Filler 49%.

[0082] The A component and the B component are mixed in a weight ratio of 1:2.

[0083] The toughening agent is selected from one or a mixture of liquid epoxy acrylate, acetonitrile rubber, liquid carboxyl-terminated nitrile rubber or hydroxyethylpi...

Embodiment 3

[0088] A process glue for integrated main board, the process glue is AB two-component, according to the mass percentage, A component includes the following components and proportions:

[0089] Acrylate or methacrylic acid 45%;

[0090] 12% defoamer;

[0091] Thinner 10%;

[0092] Penetrant 0.9%;

[0093] Toughening agent 15%;

[0094] Filler 45%;

[0095] Ammonia 1%;

[0096] Additive 0.7%;

[0097] According to the mass percentage ratio, component B includes the following components and proportions:

[0098] Butyl acrylate 25%;

[0099] Alicyclic amine 20%;

[0100] Polyetheramine 15%;

[0101] Thickener 0.9%;

[0102] Low molecular weight polyamide 10%;

[0103] Initiator 0.5%;

[0104] Additive 1.7%;

[0105] Filler 59%.

[0106] The A component and the B component are mixed in a weight ratio of 2:1.

[0107] The toughening agent is selected from one or a mixture of liquid epoxy acrylate, acetonitrile rubber, liquid carboxyl-terminated nitrile rubber or hydro...

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Abstract

The invention discloses technical glue for an integrated motherboard. The technical glue consists of a component A and a component B, wherein the component A is prepared from the following components in percentage by mass: 30 to 45 percent of acrylic ester or methacrylic acid, 3 to 12 percent of defoaming agent, 3 to 10 percent of diluent, 0.3 to 0.9 percent of penetrant, 10 to 15 percent of flexibilizer, 30 to 45 percent of filler, 0.01 to 1 percent of ammonium hydroxide and 0.1 to 0.7 percent of additive; the component B is prepared from the following components in percentage by mass: 15 to 25 percent of butyl acrylate, 10 to 20 percent of alicyclic amine, 5 to 15 percent of polyether amine, 0.3 to 0.9 percent of thickener, 3 to 10 percent of low molecular weight polyamide, 0.01 to 0.5 percent of initiator, 0.5 to 1.7 percent of additive and 39 to 59 percent of filler. The technical glue for the integrated motherboard provided by the invention solves the problem that the cost is too high in a manufacturing process of the integrated motherboard in the prior art, the technical process time is greatly shortened, so that the cost is reduced and the efficiency is improved.

Description

technical field [0001] The invention belongs to the field of process glue, and in particular relates to a process glue used for integrating main boards. Background technique [0002] An integrated motherboard, also called an integrated circuit, is a tiny electronic device or component. Using a certain process, the electronic components such as transistors, resistors, capacitors, and inductors required in a circuit are connected to each other, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a Inside the tube shell, it becomes a microstructure with the required circuit function; [0003] All the electronic components on the integrated circuit have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter IC in the circuit, which is integratedcircuit. The inventors of integrated ...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06C09J11/06C09J11/04C09J11/08
CPCC09J4/00C09J4/06C09J11/04C09J11/06C09J11/08
Inventor 李阳
Owner 合肥仁德电子科技有限公司
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