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A kind of modified silicone adhesive and preparation method thereof

A technology of organic silica gel and polyorganosiloxane, which is applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve the problems of poor performance, easy generation of bubbles and resistance to extreme temperatures, etc., and achieve excellent electrical properties and high adhesion The effect of strength and high thermal stability

Active Publication Date: 2020-06-12
上海金力泰化工股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the preparation of existing silicone adhesives, there are disadvantages such as easy generation of air bubbles and poor resistance to extreme temperatures (high temperature, low temperature) during the cementation process, resulting in few existing silicone adhesives having excellent adhesive properties at the same time. High heat resistance

Method used

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  • A kind of modified silicone adhesive and preparation method thereof
  • A kind of modified silicone adhesive and preparation method thereof
  • A kind of modified silicone adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Weigh 16 parts of benzimidazole, 23 parts of epoxy resin compound quinone type epoxy resin, polyorganosiloxane 25 parts, 3 parts of toughening agent polysulfide rubber, 0.002 parts of platinum catalyst chloroplatinic acid tetramethyldivinyldisiloxane complex, add to the reaction device under the protection of inert gas, add the curing agent diamino after stirring 1.6 parts of diphenyl sulfone, heated to 40°C, continued to stir for 20 minutes, cooled to room temperature to obtain a colorless transparent liquid, removed air bubbles under reduced pressure, heated and solidified at 30°C for 10 minutes, and the silicone adhesive was prepared .

Embodiment 2

[0017] Weigh 16 parts of benzimidazole, 21 parts of epoxy resin compound bisphenol A type epoxy resin, polyorganosiloxane 25 parts, 3 parts of toughening agent polysulfide rubber, 0.002 parts of platinum catalyst chloroplatinic acid tetramethyldivinyldisiloxane complex, add to the reaction device under the protection of inert gas, add the curing agent diamino after stirring 1.5 parts of diphenyl sulfone, heated to 40°C, continued to stir for 20 minutes, cooled to room temperature to obtain a colorless transparent liquid, removed air bubbles under reduced pressure, heated and solidified at 30°C for 10 minutes, and the silicone adhesive was prepared .

Embodiment 3

[0019] Weigh 16 parts of benzimidazole, 23 parts of epoxy resin compound quinone type epoxy resin, polyorganosiloxane 25 parts, 3 parts of toughening agent liquid silicone rubber, 0.002 parts of platinum catalyst tetramethyldivinyldisiloxane complex of chloroplatinic acid, added to the reaction device under the protection of inert gas, after stirring, add the curing agent diamino 1.7 parts of diphenyl sulfone, heated to 40°C, continued to stir for 20 minutes, cooled to room temperature to obtain a colorless transparent liquid, removed air bubbles under reduced pressure, heated and solidified at 30°C for 10 minutes, and the silicone adhesive was prepared .

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Abstract

The invention belongs to the technical field of high-molecular materials, and discloses a modified organic silicon adhesive and a preparation method thereof. The organic silicon adhesive provided by the invention is prepared from the following components in parts by weight: 15 to 20 parts of amine compound, 20 to 25 parts of epoxy resin compound, 20 to 30 parts of polysiloxane, 2 to 4 parts of toughening agent, 0.001 to 0.005 part of platinum catalyst and 1 to 2 parts of curing agent. The modified organic silicon adhesive contains both the amine compound component and the epoxy resin compound component, and an addition reaction is performed on the amine compound and the epoxy resin compound to modify the epoxy resin compound, so that the cured adhesive has very high bonding strength, also has high thermal stability, and can be widely applied to the industries of aerospace, ships, automobiles, electronic products, construction and the like.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a modified silicone adhesive and a preparation method thereof. Background technique [0002] In the 1950s, with the development of the military, structural parts such as aircraft, missiles, and spacecraft required adhesives that could work for a long time under high-temperature loading conditions. In order to meet the needs of the aviation and electronics industries, many researchers have begun to develop high temperature resistant adhesives. The high temperature resistance of the adhesive is evaluated according to the ability to maintain the bonding strength required by the design or have a certain strength retention rate in a specific temperature, time and medium, that is, the high temperature resistant adhesive must meet the following requirements: 1) High thermal weight loss temperature, high thermal deformation temperature and decomposition temperature, and good t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J163/00C09J11/06C09J11/08
CPCC08L2201/08C08L2201/10C08L2205/03C09J11/06C09J11/08C09J163/00C09J183/04C08L63/00C08K5/3447C08L83/04
Inventor 金靖童靳瑞文郭浩
Owner 上海金力泰化工股份有限公司