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A kind of tin stripping solution for removing solder material on discarded pcb and preparation method thereof

A technology of tin stripping and soldering, which is applied in the field of stripping tin stripping liquid on waste PCBs and its preparation. It can solve the problems of corroding substrates and copper surfaces and high nitric acid content, and achieve uniform tin stripping liquid and copper corrosion rate. Inhibition, high efficiency of stripping tin

Active Publication Date: 2020-04-28
YANGTZE UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problems existing in the prior art, the object of the present invention is to provide a kind of tin stripping solution and its preparation method for removing the solder material on the discarded PCB, to solve the corrosion base caused by the high content of nitric acid in the existing tin stripping solution. Material and Copper Surface Issues

Method used

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  • A kind of tin stripping solution for removing solder material on discarded pcb and preparation method thereof
  • A kind of tin stripping solution for removing solder material on discarded pcb and preparation method thereof
  • A kind of tin stripping solution for removing solder material on discarded pcb and preparation method thereof

Examples

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Embodiment 1

[0021] The tin stripping liquid of the present embodiment is composed of the following components by weight percentage: 2% iron nitrate nonahydrate, 0.2% potassium chloride, 0.6% sulfamic acid, 0.7% thiourea, sodium dodecylsulfonate 0.6%, mixed acid 40%, and the balance is deionized water. Ferric nitrate nonahydrate, potassium chloride, sulfamic acid, thiourea, and sodium dodecylsulfonate were successively added to deionized water, mixed evenly, and mixed acid was added thereto (wherein, the mixed acid was nitric acid, trifluoromethanesulfonic acid and polyphosphoric acid mixture), heated at 50°C and continued to stir for 2 hours, cooled to room temperature and allowed to stand for 12 hours to obtain a tin stripping solution.

Embodiment 2

[0023] The preparation method of the tin stripping solution in this embodiment is the same as in Example 1, except that the weight percentages of ferric nitrate nonahydrate, potassium chloride, sulfamic acid, thiourea and sodium dodecylsulfonate are respectively: 8%, 0.8%, 0.6%, 0.7%, 0.6%.

Embodiment 3

[0025] The preparation method of the tin stripping solution in this example is the same as in Example 1, except that the mass percentages of ferric nitrate nonahydrate, potassium chloride, sulfamic acid, thiourea, and sodium dodecylsulfonate are respectively: 10%, 1.0%, 0.6%, 0.7%, 0.6%.

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Abstract

The invention discloses solder stripping liquid used for stripping a soldering material on a waste PCB and a preparation method of the solder stripping liquid. The solder stripping liquid is composed of, by weight, 25-50% of mixed acid, 1.0-40.0% of an accelerant, 0.1-4.0% of a solder dissolving agent, 0.1-3.0% of a corrosion inhibitor, 0.1-3.5% of a brightener, 0.1-3.0% of a surfactant and the balance water, wherein the mixed acid is a mixture of two or more of p-toluenesulfonic acid, trifluoromethane sulfonic acid, oxalic acid, sulfosalicylic acid, phosphoric acid, hydrochloric acid, sulfuric acid, polyphosphoric acid, hydrofluoric acid and nitric acid. Through the solder stripping liquid, the problem that existing solder stripping liquid is high in nitric acid content and prone to etching a substrate and the copper surface can be solved, and the solder stripping efficiency is high.

Description

technical field [0001] The invention relates to the field of waste printed circuit board treatment, and more specifically relates to a tin stripping solution for removing solder material on waste PCBs and a preparation method thereof. Background technique [0002] With the rapid development of my country's electronics industry and the rapid replacement of electronic products, a large number of discarded printed circuit boards have appeared. These discarded printed circuit boards contain a large amount of valuable metals, the most important of which are copper and tin. The tin stripping solution is one of the largest chemical materials used to deal with these waste printed circuit boards, also known as tin stripping agent, which is suitable for the removal of tin coating, tin-lead alloy coating and tin solder joints. It is especially suitable for electronic components, and the removal of tin or lead-tin alloy layer on the copper surface of waste printed circuit boards can be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/44
CPCC23F1/44
Inventor 肖围刘雪阳王脂胭张志欣高丹缪畅苏明如
Owner YANGTZE UNIVERSITY