Plasma cavity and precleaning equipment for physical vapor deposition

A plasma and chamber technology, used in ion implantation plating, electrical components, coatings, etc., can solve problems such as uneven plasma density distribution, and achieve the effect of improving processing quality, uniform ion density, and uniform processing rate

Pending Publication Date: 2017-09-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a plasma chamber. A plasma regulating device is arranged in the plasma chamber, which solves the technical problem of uneven distribution of plasma density on the surface o

Method used

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  • Plasma cavity and precleaning equipment for physical vapor deposition
  • Plasma cavity and precleaning equipment for physical vapor deposition
  • Plasma cavity and precleaning equipment for physical vapor deposition

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Embodiment approach

[0081] According to an embodiment of the plasma chamber of the present invention, the plasma adjusting device further includes a screw and a driving device, wherein one end of the screw is screwed to the ring, and the other end is connected to the driving device; and the driving device drives the screw to rotate, The ring is driven to move up and down along the screw, thereby adjusting the distance between the ring and the base.

[0082] As an embodiment of the present invention, the plasma processing equipment includes a position adjustment device (not shown in the figure), the position adjustment device is connected to the plasma adjustment device 39, and the position adjustment device can adjust the plasma adjustment device 39 according to the actual process characteristics The distance H from the base 32 is used to adjust the density distribution of the plasma in the cavity 31 . The position adjustment device includes a screw and a driving device (such as a screw adjustmen...

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Abstract

The invention provides a plasma cavity and precleaning equipment for physical vapor deposition. The plasma cavity comprises a cavity body, a plasma generator and a base arranged in the cavity body for supporting machined workpieces, and further comprises a plasma adjusting device arranged above the base; when a process is performed, a sheath layer is formed on the surface of the plasma adjusting device; and part of ions in an area with high ion density in plasmas are neutralized as neutral particles by electrons in the sheath layer, so that the density of the ions reaching in the plasmas on the surface of the machined workpieces is uniform. The precleaning equipment for physical vapor deposition comprises the plasma cavity. The density of the plasmas in the plasma cavity and the precleaning equipment is uniformly distributed, so that the machining quality of the machined workpieces is high.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a plasma chamber and pre-cleaning equipment for physical vapor deposition. Background technique [0002] Plasma technology is widely used in semiconductor manufacturing process, such as deposition process, etching process and so on. Plasma is generated by passing reactive gas into the reaction chamber and introducing electron flow, using an external electric field (DC / AC) to accelerate the electrons, and colliding with the reactive gas to ionize the reactive gas. [0003] Capacitively coupled plasma processing equipment and inductively coupled plasma processing equipment are two typical plasma processing equipment. In the production process, in order to be able to independently control the density of the plasma and the energy of the particles in the plasma, relevant technical personnel have combined inductive coupling and capacitive coupling plasma processi...

Claims

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Application Information

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IPC IPC(8): C23C14/56H01J37/32
CPCH01J37/32853C23C14/56
Inventor 张彦召陈鹏
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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