Semiconductor package structure and manufacturing method thereof

Abstract

The invention discloses a semiconductor packaging structure and a manufacturing method thereof. The semiconductor packaging structure includes providing a first surface mount component, a first circuit board and a second circuit board; the first surface mount component includes a first chip and a conductive frame, and the first conductive frame includes a connected first carrier plate and The first metal part; the first side of the first chip is electrically connected to the first carrier of the first conductive frame; the second side of the first chip and the first metal part pass through a first pad and a second pad respectively The welding pad is connected to the first circuit board; the second circuit board is connected to the first carrier board, so that the first surface mount component is located between the first circuit board and the second circuit board. The invention provides double-sided cooling and heat dissipation performance, and has the effect of preventing electromagnetic wave interference; uses surface bonding technology to simplify the manufacturing process and production cost; effectively reduces resistance, and meets the high current requirements of automotive electronic products; no need for wire bonding in traditional packaging Process, easy to produce and rework, high reliability.

Description

technical field [0001] The invention relates to a semiconductor packaging process, in particular to a semiconductor packaging structure providing double-sided heat dissipation and a manufacturing method thereof. Background technique [0002] Highly integrated and miniaturized semiconductor products are not only a trend in consumer products, but also gradually penetrate into motor control applications. At the same time, brushless DC motors (BLDC) are also showing the same trend in many markets such as automotive electronics, medical equipment, and home appliances, and their market share is gradually surpassing other types of motors. . With the increasing demand for BLDC motors and the maturity of related motor technologies, the development strategy of BLDC motor control systems has gradually developed from discrete circuits to power module forms. [0003] Basic motor systems such as Figure 16 There are three main units shown: power electronics, gate driver and control unit...

AI Technical Summary

Problems solved by technology

As mentioned above, since the traditional method is to electrically connect the power chip in the power module by wire bonding, the heat generated by the power chip is not easy to be effectively dissipated.

[0005] In addition, due to the use of wire bonding, the parasitic inductance increases to affect the operating frequency

Furthermore, the electromagnetic interference (EMI) caused by parasitic inductance is also a technical problem that cannot be ignored and needs to be suppressed

Regarding the heat dissipation problem mentioned above, although double-sided cooling technology has been proposed and used in hybrid vehicles, it is still assembled by wafer bonding, the production process is complicated, the yield control is not good, and the wafer test coverage Insufficient and difficult matching of characteristics, etc., resulting in inconsistent efficacy of finished products

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