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Damage control method for ultraprecision turning of crystal material

A technology of crystal materials and control methods, applied in stone processing equipment, crystal growth, fine working devices, etc., can solve the problems of damage, high manufacturing cost, large consumption of irradiated ions, etc. cost, effect of reducing radiation dose and processing cost

Active Publication Date: 2017-09-26
TIANJIN UNIV
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  • Abstract
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  • Claims
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Problems solved by technology

[0006] In response to the above problems, the purpose of the present invention is to overcome the shortcomings of the prior art that consume large amounts of irradiated ions and high manufacturing costs, and combine the interaction process between the ultra-precision turning tool and the workpiece to propose an ultra-precision turning process for crystal materials. Control Method

Method used

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  • Damage control method for ultraprecision turning of crystal material
  • Damage control method for ultraprecision turning of crystal material
  • Damage control method for ultraprecision turning of crystal material

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Embodiment

[0023] 1. Design a multilayer amorphous system according to the material to be processed and cutting parameters, determine the number, depth and thickness of the amorphous layer, and use Monte Carlo (implemented by SRIM software) numerical method to simulate the ion irradiation process and calculate the ion source , Injection energy and dose parameter combination.

[0024] 2. Use commercial ion implanters or high-energy accelerators for ion irradiation according to the calculated implantation parameters to complete the preparation of the multilayer amorphous structure inside the material;

[0025] 3. Combining the tool arc radius, cutting depth, geometric parameters of the amorphous layer and the brittle-plastic transition thickness of the workpiece material, determine the maximum feed rate allowed for turning;

[0026] 4. According to the above turning parameters, the plane processing experiment is carried out on the modified crystal and the ordinary crystal.

[0027] The ion implant...

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Abstract

The invention relates to a damage control method for ultraprecision turning of a crystal material. The damage control method for ultraprecision turning of the crystal material comprises the steps that a multi-layer amorphous system is designed according to the to-be-machined material and cutting parameters, the number, the depth and the thickness of amorphous layers are determined, the ion irradiation process is simulated through the Monte Carlo numerical method, and an ion source, implantation energy and the dosage combination are worked out; ion irradiation is conducted through an ion implanter or a high-energy accelerator according to the worked-out implantation parameters, and a multi-layer amorphous structure in the material is prepared; the allowable maximum feed rate for turning is determined according to the arc radius of a tool, the cutting depth, geometrical parameters of the amorphous layers, and the brittleness-plasticity conversion thickness of the workpiece material; and planar machining is conducted on a modified crystal according to the turning parameters.

Description

Technical field [0001] The invention relates to an ultra-precision turning processing method. Background technique [0002] Diamond turning can be traced back to the Second World War in the 1940s. After long-term development, it has become one of the core technologies of modern ultra-precision machining. Its application fields have also expanded from military and national defense to scientific research and civilian use. With the guarantee of ultra-precision machine tools and high-hardness and high-rigidity tools, diamond turning can complete very accurate tool motions and realize optical-level surface processing. Its surface accuracy and surface roughness can reach sub-micron and nano-levels, respectively. In addition, ultra-precision turning is currently the best solution for optical free-form surface processing. Compared with grinding, it can not only meet the complex surface requirements, but also effectively relieve processing damage, reducing or even eliminating the need for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00C30B33/04
CPCB28D5/00C30B33/04
Inventor 张效栋王金石房丰洲
Owner TIANJIN UNIV
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