An electrowetting device with a spacer and its preparation method

A spacer, electrowetting technology, applied in the field of electrowetting, can solve the problems of device center collapse, complex preparation process, functional failure, etc., and achieve the effect of preventing internal collapse, low operation difficulty, and strong operability
CN107305286BActive Publication Date: 2020-08-25SOUTH CHINA NORMAL UNIVERSITY +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SOUTH CHINA NORMAL UNIVERSITY
Publication Date
2020-08-25

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Abstract

The invention discloses an electrowetting device with a spacer and a preparation method thereof. The spacer material is firstly taken, heat-cured under yellow light, and ground to obtain spacer microspheres, and then the spacer microspheres are sprinkled on the coated On the pixel wall material, the pixel wall material is cured again, and then the pixel wall and the spacer are prepared at the same time by one photolithography. The partial structure of the microspheres in the curing area, when the upper substrate and / or the lower substrate are deformed, the spacer is in contact with the upper substrate, which can effectively prevent the internal collapse of the electrowetting device; because the spacer The spacer is obtained by photolithography of microspheres, and the spacer will not affect the connectivity of the polar electrolyte solution; because the pixel wall and the spacer are obtained by one-step photolithography, compared with the preparation of the spacer by two photolithography There is no error chain caused by two lithography alignments, the precision is higher, the process is simpler, and the operation is less difficult.
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Description

technical field

[0001] The invention relates to the field of electrowetting technology, in particular to an electrowetting device with a spacer and a preparation method thereof. Background technique

[0002] The so-called wetting refers to the process in which one fluid on a solid surface is replaced by another fluid. The liquid can spread on the solid surface, and the solid-liquid contact surface tends to expand, that is, the adhesion force of the liquid to the solid surface is greater than its cohesive force, which is wetting. The liquid cannot spread on the solid surface, and the contact surface tends to shrink into a spherical shape, that is, it is not wet, and the non-wet means that the adhesion force of the liquid to the solid surface is less than its cohesive force. Electrowetting (Electrowetting, EW) refers to the phenomenon of changing the wettability of the droplet on the substrate by changing the voltage between the droplet and the insulating substrate, that is, ...

Claims

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