Dry film developing solution for printed circuit board and preparation method of dry film developing solution

A technology for printed circuit boards and developer, which is applied in the chemical industry, can solve the problems of large developer waste water treatment, easy generation of a large number of bubbles, and increased production costs, so as to reduce residual image phenomenon, reduce decomposition rate and corrosiveness, The effect of promoting clearance

Active Publication Date: 2017-11-10
惠州威尔高电子有限公司
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned developing solution will seriously affect the environment after being discharged, and a large number of bubbles are likely to be generated during the developing process, which will affect the display of patterns.
[0006] In addition, in the dry film development process, generally 500L of dry film developer can produce 1000 square meters of PCB boards, and each development line discharges 500L of developer once a day, and the developer belongs to high-concentration wastewater, and the treatment cost is high
In the prior art PCB developer management method, the developer wastewater needs to be discharged and treated every day. Due to the large amount of developer wastewater treatment, high concentration, and low treatment efficiency, the production cost is greatly increased.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dry film developing solution for printed circuit board and preparation method of dry film developing solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1, a kind of dry film developer for printed circuit board

[0031] The dry film developer for printed circuit boards is composed of the following components and content:

[0032] Potassium carbonate 0.2kg, sodium carbonate 0.8kg, sodium hypochlorite 0.08kg and water 95kg.

[0033] Preparation:

[0034] S1 Add potassium carbonate and sodium carbonate to water, stir until completely dissolved to obtain a mixed solution;

[0035] S2 Add sodium hypochlorite to the mixed solution obtained in step S1 and stir evenly to obtain final product.

Embodiment 2

[0036] Embodiment 2, a kind of dry film developing solution for printed circuit board

[0037] The dry film developer for printed circuit boards is composed of the following components and content:

[0038] Potassium carbonate 0.4kg, sodium carbonate 0.5kg, sodium hypochlorite 0.1kg and water 99kg.

[0039] The preparation method is similar to Example 1.

Embodiment 3

[0040] Embodiment 3, a kind of dry film developer for printed circuit board

[0041] The dry film developer for printed circuit boards is composed of the following components and content:

[0042] Potassium carbonate 0.4kg, sodium carbonate 0.5kg, sodium hypochlorite 0.1kg, sodium alginate 4kg and water 99kg.

[0043] Preparation:

[0044] S1 Add potassium carbonate and sodium carbonate to water, stir until completely dissolved to obtain a mixed solution;

[0045] S2 Add sodium hypochlorite and sodium alginate to the mixed solution obtained in step S1 and stir evenly to obtain.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of chemical engineering, in particular to a dry film developing solution for a printed circuit board and a preparation method of the dry film developing solution. The dry film developing solution for the printed circuit board, provided by the invention, is mainly prepared from potassium carbonate, sodium carbonate, sodium hypochlorite and water. The dry film developing solution for the printed circuit board, provided by the invention, has the advantages of high stability and low corrosion; meanwhile, the developing property of minute patterns can be maintained and fine patterns can be displayed; besides, residues and bubbles on a dry film can be reduced, so that the display quality of the patterns is ensured. Furthermore, the dry film developing solution for the printed circuit board, provided by the invention, has the advantages that the condition that water soluble organic polymer salts remained on the dry film are hard to clean can be prevented, the production of water insoluble polymers also can be prevented, and environmental pollution is reduced; the dry film developing solution is a green and environment-friendly dry film developing solution.

Description

technical field [0001] The invention relates to the technical field of chemical industry, in particular to a dry film developer for printed circuit boards and a preparation method thereof. Background technique [0002] With the development of the electronics industry in the direction of high speed and miniaturization, the requirements for assembly density are getting higher and higher. The pattern transfer process is an important link in the production of printed circuit boards. Since the dry film was put on the market, it has experienced the development process of solvent type, semi-water-soluble type and water-soluble type. At present, water-soluble dry film is generally used as the material for graphic transfer. The water-soluble dry film contains organic polymer compounds, and its main components are: film-forming resin, photopolymerizable monomer, photoinitiator, plasticizer, tackifier, thermal polymerization inhibitor, colorant and solvent. The principle of the dry ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/32
CPCG03F7/32
Inventor 冯红波李灶保
Owner 惠州威尔高电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products