Architectural insulated board and preparation method thereof

A technology for thermal insulation boards and buildings, applied in the field of building materials, can solve the problems of poor thermal insulation, poor strength, and limited application scope, and achieve the advantages of increasing tensile strength, improving service life, and increasing physical strength. Effect

Inactive Publication Date: 2017-12-01
温州月煌科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The thermal insulation board is a board made of thermal insulation materials, which is not only convenient for transportation, but also reduces the human factors in the construction, and the quality is greatly guaranteed. The thermal insulation board can meet the current energy-saving needs of building buildings. The preferred panel to improve the thermal insulation level of industrial and civil building exterior walls is also the first panel for energy-saving renovation of existing buildings; but there are problems such as poor thermal insulation, poor strength, and large application limitations.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A kind of thermal insulation board for building of the present embodiment comprises the following raw materials in parts by weight:

[0030] 6 parts of polyvinyl acetate emulsion, 1 part of butyl rubber, 5 parts of ceramic fiber, 4 parts of steel fiber, 15 parts of glass wool, 5 parts of expanded vermiculite, 5 parts of sepiolite powder, 12 parts of diatomaceous earth, 7 parts of talcum powder , 2 parts of asphalt, 1 part of water glass, 0.1 part of light stabilizer, 0.1 part of water reducer, and 1 part of curing agent.

[0031] In this embodiment, the length of the ceramic fiber and the steel fiber is 2 mm, and the diameter is 1 mm.

[0032] In this embodiment, the mesh number of sepiolite powder and talcum powder is 80 mesh.

[0033] In this embodiment, the light stabilizer is a mixture of ultraviolet absorbers and free radical scavengers, the weight ratio between the two is 3:1, and the ultraviolet absorbers are o-hydroxybenzophenones, benzotriazoles, A mixture of...

Embodiment 2

[0044] A kind of thermal insulation board for building of the present embodiment comprises the following raw materials in parts by weight:

[0045] 7 parts of polyvinyl acetate emulsion, 1.5 parts of butyl rubber, 8 parts of ceramic fiber, 6 parts of steel fiber, 17 parts of glass wool, 6 parts of expanded vermiculite, 6 parts of sepiolite powder, 13 parts of diatomaceous earth, 8 parts of talcum powder , 3 parts of asphalt, 2 parts of water glass, 0.15 parts of light stabilizer, 0.5 parts of water reducing agent, and 1.5 parts of curing agent.

[0046] In this embodiment, the length of the ceramic fiber and the steel fiber is 2.5mm, and the diameter is 1.5mm.

[0047] In this embodiment, the mesh number of sepiolite powder and talcum powder is 90 mesh.

[0048] In this embodiment, the light stabilizer is a mixture of ultraviolet absorbers and free radical scavengers, the weight ratio between the two is 3:1, and the ultraviolet absorbers are o-hydroxybenzophenones, benzotriaz...

Embodiment 3

[0059] A thermal insulation board for building, comprising the following raw materials in parts by weight:

[0060]8 parts of polyvinyl acetate emulsion, 2 parts of butyl rubber, 10 parts of ceramic fiber, 8 parts of steel fiber, 20 parts of glass wool, 7 parts of expanded vermiculite, 7 parts of sepiolite powder, 15 parts of diatomite, 9 parts of talcum powder , 4 parts of asphalt, 3 parts of water glass, 0.2 parts of light stabilizer, 1 part of water reducing agent, and 2 parts of curing agent.

[0061] In this embodiment, the length of the ceramic fiber and the steel fiber is 3 mm, and the diameter is 2 mm.

[0062] In this embodiment, the mesh number of sepiolite powder and talc powder is 100 mesh.

[0063] In this embodiment, the light stabilizer is a mixture of ultraviolet absorbers and free radical scavengers, the weight ratio between the two is 3:1, and the ultraviolet absorbers are o-hydroxybenzophenones, benzotriazoles, A mixture of salicylates, triazines, and subs...

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Abstract

The invention discloses an architectural insulated board and belongs to the technical field of building materials. The architectural insulated board comprises the following raw materials in parts by weight: 6-8 parts of polyvinyl acetate emulsion, 1-2 parts of butyl rubber, 5-10 parts of ceramic fibers, 4-8 parts of steel fibers, 15-20 parts of glass wool, 5-7 parts of expanded vermiculite, 5-7 parts of sepiolite powder, 12-15 parts of diatomite, 7-9 parts of talcum powder, 2-4 parts of asphalt, 1-3 parts of sodium silicate, 0.1-0.2 part of a light stabilizer, 0.1-1 part of a water reducing agent and 1-2 parts of a curing agent. The invention further discloses a preparation method of the architectural insulated board. The architectural insulated board disclosed by the invention is simple in preparation and high in strength and has excellent thermal insulation capacity.

Description

technical field [0001] The invention relates to the technical field of building materials, in particular to a building thermal insulation board and a preparation method thereof. Background technique [0002] Insulation materials are materials with a thermal coefficient less than or equal to 0.2. According to their materials, they are divided into three categories: inorganic insulation materials, organic insulation materials, and composite insulation materials. Traditional thermal insulation materials are mainly based on increasing the gas phase void ratio and reducing the thermal conductivity and conductivity; in order to increase convective heat transfer and radiation heat transfer in the use environment, fiber-based thermal insulation materials must have a thicker coating ; while the profile-type inorganic thermal insulation materials need to be assembled and constructed, there are defects such as many seams, damage to the appearance, poor waterproofness, and short service...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/26C04B111/20
CPCC04B26/26C04B2111/00612C04B2111/20C04B24/2623C04B18/22C04B14/46C04B14/48C04B14/204C04B14/042C04B14/08C04B22/00C04B2103/605C04B2103/302C04B2103/60C04B2103/0068
Inventor 刘东升
Owner 温州月煌科技有限公司
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