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Stress relief adhesive and preparation method thereof

A technology for dispersing glue and stress, applied in the field of materials, can solve the problems of low elasticity, poor adhesion of insulating silicone rubber, weak tear resistance, etc., and achieves improved utilization, good dielectric properties, and good adhesion. Effect

Inactive Publication Date: 2017-12-01
HONGSHANG HEAT SHRINKABLE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The stress tape provided by the prior art has many defects, such as poor high and low temperature resistance, poor adhesion to insulating silicone rubber, rough surface, low elasticity, weak tear resistance, high dielectric constant and high resistivity. bad cooperation

Method used

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  • Stress relief adhesive and preparation method thereof
  • Stress relief adhesive and preparation method thereof
  • Stress relief adhesive and preparation method thereof

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preparation example Construction

[0031] This implementation also provides a preparation method for the above-mentioned stress evacuation glue, which includes mixing the raw materials, preferably in an internal mixer, mixing at 100-150°C for 30-45min to form a mixed rubber, and mixing the mixed rubber at 80-100°C Stress evacuation tape is made by lower extrusion and calendering. Preferably, the compounded rubber is extruded by a screw extruder equipped with a die at 80-100°C; the calendered tape is packaged with double-sided release paper to obtain the final product. stress relief tape products.

[0032] In a preferred embodiment of the present invention, chlorine-containing polymer, silicone rubber, polyisobutylene rubber, surface-activated high-dielectric filler, tributyl citrate, resin, dispersant, stearic acid, rubber defoaming agent and composite antioxidant are added to the internal mixer in turn and mixed. Controlling the sequence of raw materials not only allows them to be thoroughly mixed, but also i...

Embodiment 1

[0036] This embodiment provides a kind of stress evacuation glue, by weight parts, comprising:

[0037]

[0038]

[0039] (Composite antioxidants include: 4 parts of polyphenol antioxidants, 1.5 parts of thioether antioxidants, 1.5 parts of triazine antioxidants)

[0040]This embodiment also provides a preparation method for the above-mentioned stress evacuation glue, including:

[0041] Put the above raw materials into the internal mixer in turn and mix them at 120°C for 30 minutes until the materials are evenly mixed and the masterbatch forms a mixed rubber.

Embodiment 2

[0043] This embodiment provides a kind of stress evacuation glue, by weight parts, comprising:

[0044]

[0045]

[0046] (Composite antioxidants include: 4 parts of polyphenol antioxidants, 1.5 parts of thioether antioxidants, 1.5 parts of triazine antioxidants)

[0047] This embodiment also provides a preparation method of the above-mentioned stress evacuation glue, which includes: sequentially adding the above raw materials into an internal mixer for mixing, and mixing at 150° C. for 30 minutes until the materials are uniformly mixed, and the masterbatch forms a mixed glue.

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Abstract

The invention provides a stress relief adhesive and a preparation method thereof and relates to the technical field of materials. The stress relief adhesive is prepared from, in parts by weight, 20-80 parts of a chlorine-containing polymer, 1-5 parts of silicone rubber, 5-30 parts of polyisobutylene rubber, 20-40 parts of high-dielectric filler subjected to surface activating treatment, 15-50 parts of tributyl citrate, 5-20 parts of resin, 1-5 parts of a dispersant, 1-5 parts of stearic acid, 1-5 parts of a rubber defoaming agent and 5-15 parts of a compound antioxidant, wherein the compound antioxidant is prepared from a polyphenol antioxidant, a thioether antioxidant and a triazine antioxidant in the mass ratio being (4-5):(1-2):(1-2). The stress relief adhesive has the advantages of good adhesion, high elasticity, high tear resistance, high strength and good dielectricity. The method comprises steps as follows: the raw materials are mixed at the temperature of 100-150 DEG C for 30-45 min, and a rubber compound is formed; the rubber compound is extruded at the temperature of 80-100 DEG C. The method is simple and high in operability and facilitates large-scale industrial production.

Description

technical field [0001] The invention relates to the technical field of materials, and in particular to a stress-relieving glue and a preparation method thereof. Background technique [0002] Stress evacuation tape is often used for tight winding and encapsulation at cable terminals and intermediate joints, forming a certain characteristic impedance at the cable shielding end, and playing the role of electrical stress control and sealing bonding. [0003] The stress tape provided by the prior art has many defects, such as poor high and low temperature resistance, poor adhesion to insulating silicone rubber, rough surface, low elasticity, weak tear resistance, high dielectric constant and high resistivity. The cooperation is not good and so on. In addition, for heat-shrinkable cable accessories used in nuclear power plants, due to the special environmental conditions of the place where they are used, high safety is required, that is, they should not only have the excellent el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J127/06C09J183/07C09J123/20C09J123/28C09J111/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/2206C08L2201/08C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J123/286C09J127/06C08L83/04C08L23/22C08L101/00C08K13/06C08K5/11C08K5/09C08K3/22C08L27/06C08L23/286C08L71/03C08L11/00
Inventor 翟永爱钟晓光曾利雷潍马毅辉
Owner HONGSHANG HEAT SHRINKABLE MATERIALS