A strain loading system for multi-field joint characterization of micro-nano materials

Abstract

The invention discloses a strain loading system for multi-field joint characterization of micro-nano materials. The sample stage is fixed on the uppermost end of the base body by spring screws. Piezoelectric ceramics and piezoelectric ceramics are fixed on the upper end of the base base bottom. The loading stage is adhered to the metal support. In the groove, the metal support is fixed to the groove on the right side of the sample stage by the metal support screw. The electrode pressing piece is fixed on the top of the sample stage. The electrode pressing piece is in close contact with the electrode on the loading stage to form excellent electrical contact. The indenter is fixed on The metal bracket is fixed on the top surface of the piezoelectric ceramic in the groove of the metal bracket. The micro-nano material strain loading and electrical measurement system in various characterization equipment of the present invention has the characteristics of simple structure, reliable performance, easy installation, easy operation, and wide application range, and can be applied to all one-dimensional or two-dimensional materials with a length greater than 5 microns. Dimensional nanomaterials can be used with a variety of optical microscopes, electron microscopes, spectrometers, synchrotron radiation and other instruments to conduct multi-field coupling tests.

Description

Technical field [0001] The invention relates to the research field of elastic strain of micro-nano materials, and relates to a method and device for uniaxial strain generation applied to the joint characterization of micro-nano materials with multiple fields (force, electricity, heat, light, etc.), in particular to a microelectronics-based Strain loading system for multi-field characterization of micro-nano materials based on mechanical system (MEMS) technology and mechanical processing technology. Background technique [0002] The world-renowned material mechanics scholar John J. Gilman explained in his book "Electronic Basis of the Strength of Materials" (Cambridge University Press, 2008) the theoretical strength of materials (the bond between atoms under this stress will The close relationship between spontaneous fracture or switching) and drastic electronic structural changes (such as the closure of the semiconductor band gap). Because almost all the physical and chemical pr...

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Problems solved by technology

But the disadvantages are: 1. The applied strain has been fixed and cannot be changed; 2. In the process of material growth, the dislocation of the substrate will inevitably be introduced into the studied material, resulting in the maximum strain that the target material can bear is limited. Great limitations; 3. This method cannot apply strain to chemically grown one-dimensional or two-dimensional materials; 4. It is difficult to test the electrical properties of target materials

The flexible substrate deformation method uses a flexible substrate instead of the above-mentioned rigid substrate, and the strain range is greatly increased, but the strain state of this method is relatively complicated and the accuracy of the applied strain is low and it is difficult to accurately quantify (Flexible piezoresistive strain sensor based on single Sb-doped ZnOnanobelt, Y.Yang , et al., Applied Physics Letters, 97, 223107, 2010)

[0007] None of the above methods can test and characterize the electrical, optical, and structural properties of micro-nano materials while applying adjustable uniaxial strain to micro-nano materials in a wide range. Strain Engineering Research Requirements

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