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Silver-coated copper powder and conductive paste, conductive material, and conductive sheet using same

A silver-copper, coating technology, applied in conductive coatings, conductive materials, conductive materials, etc., to achieve the effect of preventing agglomeration and excellent conductivity

Inactive Publication Date: 2017-12-01
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional silver-clad copper powder having a dendrite-like shape is a dendrite characterized by long branches branching from the main axis, and since it has a slender and dendritic shape, from the viewpoint of ensuring a contact point, Then the structure is relatively simple and the shape of the contact point can be effectively ensured by using less silver-coated copper powder, which is not an ideal shape.

Method used

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  • Silver-coated copper powder and conductive paste, conductive material, and conductive sheet using same
  • Silver-coated copper powder and conductive paste, conductive material, and conductive sheet using same
  • Silver-coated copper powder and conductive paste, conductive material, and conductive sheet using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0144]

[0145] In an electrolytic cell with a capacity of 100L, a titanium electrode plate with an electrode area of ​​200mm×200mm is used as the cathode, and a copper electrode plate with an electrode area of ​​200mm×200mm is used as the anode, and the electrolyte is filled into the electrolytic cell. In the tank, a direct current is passed through it to precipitate copper powder (dendritic copper powder) onto the cathode plate.

[0146] At this time, as the electrolytic solution, an electrolytic solution having a composition having a copper ion concentration of 5 g / L and a sulfuric acid concentration of 150 g / L was used. In addition, Safranin O (manufactured by Kanto Chemical Co., Ltd.) was added as an additive so that the concentration in the electrolyte was 100 mg / L, and the concentration of chloride ions (chloride ions) in the electrolyte was A hydrochloric acid solution (manufactured by Wako Pure Chemical Industries, Ltd.) was added so as to be 10 mg / L. Next, under t...

Embodiment 2

[0158]

[0159] As the electrolytic solution, an electrolytic solution having a copper ion concentration of 7 g / L and a sulfuric acid concentration of 150 g / L was used, and safranin O was added as an additive so that the concentration in the electrolytic solution became 150 mg / L. , and furthermore, a hydrochloric acid solution was added so that the concentration of chloride ions in the electrolytic solution became 25 mg / L. Next, under the following conditions, the current density of the cathode is 20A / dm 2 The copper powder was deposited on the cathode plate by energizing in such a way that the electrolytic solution whose concentration was adjusted as described above was circulated at a flow rate of 15 L / min using a pump, and the temperature was maintained at 25°C. Use a scraper to mechanically scrape the electrolytic copper powder deposited on the cathode plate to the bottom of the electrolytic tank and recover it. After washing the recovered copper powder with pure water, ...

Embodiment 3

[0170] The dendritic silver-coated copper powder produced in Example 1 was dispersed in a resin to prepare an electromagnetic wave shielding material. In addition, the preparation of the dendritic copper powder used to produce the dendritic silver-coated copper powder, and the conditions until the dendritic copper powder was coated with silver to produce the dendritic silver-coated copper powder were set to be the same as in Example 1, using silver Dendritic silver-coated copper powder whose coating amount is 26.2 mass % with respect to mass 100% of the whole silver-coated copper powder coated with silver.

[0171] 100 g of vinyl chloride resin and 200 g of methyl ethyl ketone were mixed with 40 g of the dendritic silver-coated copper powder, and kneading at 1500 rpm for 3 minutes was repeated four times using a small kneader to perform creaming. When pasting, the copper powder is uniformly dispersed in the resin without agglomeration. This was applied onto a substrate made o...

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Abstract

Provided is a silver-coated copper powder that has a dendritic shape, that ensures excellent conductivity as a result of having an increased number of points of contact when silver-coated dendritic copper particles are in contact, that prevents aggregation, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The silver-coated copper powder comprises amassed dendritic copper particles 1 having a linearly grown main trunk 2 and a plurality of branches 3 branching from the main trunk 2. The surface of the copper particles 1 is coated with silver. The main trunk 2 and the branches 3 of the copper particles 1 have a flat plate shape in which the average cross-sectional thickness is more than 1.0 [mu]m but no more than 5.0 [mu]m. The silver-coated copper powder has a flat plate shape configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 [mu]m.

Description

technical field [0001] The present invention relates to a copper powder coated with silver on the surface (silver-coated copper powder), and more specifically, to a novel dendritic silver-coated copper powder whose conductivity can be improved by using it as a material such as a conductive paste and the like. Copper paste, conductive paint, and conductive sheet using the silver-coated copper powder. Background technique [0002] In the formation of wiring layers and electrodes of electronic equipment, pastes or paints using metal fillers such as silver powder or silver-coated copper powder, such as resin-type pastes or sintered pastes, and electromagnetic wave shielding paints, are often used. Metal filler paste of silver powder or silver-clad copper is coated or printed on various substrates, and subjected to heat-curing or heat-firing treatment to form a conductive film that becomes a wiring layer or an electrode. [0003] For example, resin-type conductive paste is compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02C09C1/62C09C3/06C09D5/24C09D201/00C23C18/42C25C5/02H01B1/00H01B1/22H01B5/00B22F1/052B22F1/06B22F1/068B22F1/10B22F1/103B22F1/107B22F1/17
CPCB22F1/00C09C1/62C09D5/24C09D201/00C25C5/02H01B1/22H01B5/00B22F9/24C09C1/66C09D5/32H01B1/026H05K9/0083C01P2004/03C01P2006/40C01P2006/42C09D7/70C08K9/02C08K2003/085C23C18/1635C23C18/1834C23C18/44C23C18/54B22F2301/10B22F2301/255B22F2304/10B22F1/068B22F1/103B22F1/10B22F1/17B22F1/052B22F1/107B22F1/06C09D7/61C09C1/627C09C3/063C23C18/42C09C3/06C09C3/066H01J37/28
Inventor 冈田浩山下秀幸
Owner SUMITOMO METAL MINING CO LTD