Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Energy-sensitive resin composition

A resin composition, sensitive technology, applied in the direction of instruments, optics, optomechanical equipment, etc., can solve the problems of inapplicability, heat resistance, etc., and achieve excellent tensile elongation and chemical resistance, dielectric constant low effect

Active Publication Date: 2017-12-01
TOKYO OHKA KOGYO CO LTD
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the conventional method of forming insulating materials and protective materials containing polyimide resins using polyimide precursors, heat treatment at high temperatures is required, so there is a problem that it cannot be applied to materials that are not heat-resistant

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Energy-sensitive resin composition
  • Energy-sensitive resin composition
  • Energy-sensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0739]

[0740] The method for preparing the energy-sensitive resin composition according to the present invention is not particularly limited. For example, it can be prepared by blending the following components: as the resin precursor component (B), selected from the various monomer components described above and at least one of the group consisting of a precursor polymer; a solvent (S); an imidazole compound (A); and the above-mentioned other components added as necessary.

[0741] Both a monomer component and a precursor polymer can be mix|blended as a resin precursor component (B), Usually, only a monomer component or only a precursor polymer is sufficient. From the viewpoint that the molecular weight of the ring-forming polymer can be increased in the presence of the imidazole compound (A) as described later, it is preferable to synthesize Cycloforming polymers.

[0742] Moreover, it is preferable to mix|blend a precursor polymer as (B) component from a viewpoint whic...

Embodiment 1～27、 comparative example 1～14

[0796] In Examples and Comparative Examples, the following diamine compound (2b), carboxylic anhydride, diamine diol, dicarbonyl compound, solvent, imidazole compound (A) and comparative compound were used.

[0797] ・Diamine compound (2b)

[0798] DA1: ODA: 4,4’-diaminodiphenyl ether

[0799] DA2: PPD: p-phenylenediamine

[0800] DA3: MPD: m-phenylenediamine

[0801] DA4: 2,4-TDA: 2,4-diaminotoluene

[0802] DA5: BAFL: 9,9-bis(4-aminophenyl)fluorene

[0803] DA6: BTFL: 9,9-bis(4-amino-3-methylphenyl)fluorene

[0804] DA7: BisA-P: 4,4’-[1,4-phenylenebis(1-methylethane-1,1-diyl)]diphenylamine

[0805] DA8: MDA: 4,4'-Diaminodiphenylmethane

[0806] [chemical formula 82]

[0807]

[0808] DA9: 2,2-bis[4-(4-aminophenoxy)phenyl]propane

[0809]DA10: 1,4-bis(4-amino-α,α-dimethylbenzyl)benzene

[0810] DA11: 1-(4-aminophenyl)-1,3,3-trimethyl-1H-inden-5-amine

[0811] DA12: 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane

[0812] ·Carboxylic anhydride

[0813] TC1: PM...

Embodiment 1～25

[0869] To the solution of the imide ring and / or oxazole ring-forming polymer obtained in each preparation example, any one of compounds 1 to 5 was added in the amount described in Table 1 and stirred to prepare an energy-sensitive resin combination.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
boiling pointaaaaaaaaaa
boiling pointaaaaaaaaaa
coating thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention provides an energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. Also provided are a method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition comprises an imidazole compound (A) represented by formula (1a), a resin precursor component (B), and a solvent (S), wherein the resin precursor component (B) is at least one resin precursor component selected from the group consisting of: a monomer component comprising a diamine compound represented by formula (2), a dicarbonyl compound represented by formula (3a) and / or a tetracarboxylic acid dianhydride represented by formula (3b); and a precursor polymer having a repeating unit represented by formula (4).

Description

technical field [0001] The present invention relates to an energy-sensitive resin composition, a method for producing a film or a molded body using the energy-sensitive resin composition, a method for forming a pattern using the energy-sensitive resin composition, and a permanent film, the energy-sensitive resin The composition contains a precursor polymer of a polymer containing an imide ring and / or an oxazole ring, such as a polyimide resin or a polybenzoxazole resin, and / or a monomer component of the precursor polymer. Background technique [0002] Polyimide resin has properties such as excellent heat resistance, mechanical strength, insulation, and low dielectric constant, so it is used as an insulating material, It is widely used for protective materials. In addition, in precision electric and electronic parts, in order to selectively insulate or protect minute parts, polyimide resins patterned into desired shapes are used. [0003] Generally, a polyimide resin is a p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G12/06C08G14/073C08K5/3445C08L61/00C08L79/04G03F7/038
CPCC08K5/3445C08L79/04G03F7/0387C08G73/1042C08G73/105C08G73/1071C08G73/1078C08L79/08G03F7/038C08G73/0233C08G12/06C08G73/1007C08G73/1032C08K5/101C08K5/3415C08L77/06C08L2203/16
Inventor 野田国宏千坂博树盐田大
Owner TOKYO OHKA KOGYO CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com