Preformed solder containing soldering flux and preparation method thereof

Abstract

The invention relates to the technical field of materials for electronic device welding and specifically discloses a kind of performed solder containing soldering flux and a preparation method thereof. The performed solder containing the soldering flux comprises a soldering material and the soldering flux wrapped in the soldering material; the mass percent of the soldering material is 95%-99.9%, and the mass percent of the soldering flux is 0.1%-5%. The preparation method of the performed solder containing the soldering flux comprises the steps of preparing the soldering flux; smelting and casting an ingot of the soldering material; conducting charging and extruding the ingot of the soldering material into a preform body; rolling the perform body into a material strap; and cutting the material strap. By adopting the performed solder provided by the invention, the deficiencies of dipping the liquid soldering flux and externally applying the solid soldering flux are made up; the soldering flux can reduce the surface tension of the molten soldering material, facilitates wetting and spreading of the performed solder, promotes welding, prevents secondary oxidation of the performed solder and has an auxiliary heat conduction effect as a thermal bridge. By means of the performed solder containing the soldering flux, the welding quality is effectively improved, the good welding effect is achieved, the stability of the welding process can be guaranteed, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of materials for welding electronic devices, in particular to a preformed solder containing flux and a preparation method thereof. Background technique [0002] With the increasing precision and integration of electronic components and the particularity of certain welding processes, the existing solder paste, tin wire, etc. can no longer meet the increasingly high requirements of electronic components, so preformed solder came into being. Solder preforms have the characteristics of various shapes, precise molding, precise dosage (solder and flux), stable welding quality, convenient use, simple and efficient production, and are widely used in chip welding, optical fiber device welding, connector and terminal equipment welding, Fields such as circuit board printing assembly and electronic packaging are increasingly favored by the electronics industry. [0003] The traditional soldering methods include vacuum ...

AI Technical Summary

Problems solved by technology

Dip in liquid flux when using, the flux content is not easy to control, it is easy to cause flux splash and residue problems

The use of solder preforms with solid flux pre-coated on the surface can control the flux content to a certain extent and reduce the problems of flux splash and residue, but some shapes of solder preforms are easy to deform during mass production and coating. It is difficult to apply flux on the surface of the coil, and the flux coated on the coil is easy to adhere to the tool when the coil is cut, and the flux layer is easy to damage and scatter. The most important thing is that the uniformity of the flux is not easy to control. The flux of some small rings is easy to block the small holes when mass-produced and coated, and when the automatic patch assembly is performed, due to the certain viscosity of the externally coated flux, it is easy to adhere to the packaging bag and the assembly nozzle or fixture, making it difficult to automatically fall off. Material assembly brings great inconvenience to production

Images