Heating device based on electromagnetic induction

A heating device, electromagnetic induction technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problem of high heating temperature and temperature uniformity requirements, high heating temperature uniform heating temperature, temperature uniformity Difficult to control and other problems, to achieve the effect of high energy utilization efficiency, high heating temperature and fast heating speed

Active Publication Date: 2017-12-15
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI +1
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Thermal radiation heating has the advantages of simple design and good temperature uniformity, but it also has disadvantages such as low energy utilization efficiency, slow temperature rise, and low temperature.
Induction heating overcomes the above shortcomings, with fast temperature rise and high energy utilization efficiency, but it is difficult to control the temperature uniformity. At the same time, due to the alternating magnetic field generated in the space, eddy currents will also be induced in parts that do not need to be heated, and the magnetic field will also May cause electromagnetic interference to other electrical equipment
However, the growth of thin film materials requires high heating temperature and temperature uniformity of the heating device. It is difficult for existing heating equipment to meet the requirements of high heating temperature and uniform heating temperature at the same time.

Method used

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  • Heating device based on electromagnetic induction
  • Heating device based on electromagnetic induction
  • Heating device based on electromagnetic induction

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Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are well known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints.

[0040] The invention provides a heating device based on electromagnetic induction. Such as figure 1 as shown, figure 1 It is a schematic cross-sectional stru...

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Abstract

The invention provides a heating device based on electromagnetic induction. A magnetizer is placed on the periphery of a tray, and the vast majority of magnetic lines are concentrated nearby the tray, so that heating temperature is higher, and the heating speed is higher. Since the magnetic lines are evenly distributed in the tray, temperature uniformity is better. The magnetizer can be used for gathering the magnetic lines, guide the direction of the magnetic lines and reduce magnetic resistance, and heat radiated by the tray to the lower portion of a reaction cavity is reflected back to the tray through the tray, so that the energy utilization efficiency is improved. The majority of magnetic lines are concentrated around the tray, the distribution space range of the magnetic lines is reduced, and therefore electromagnetic influences on other units in the device and device external environment are reduced.

Description

technical field [0001] The invention relates to a heating device, in particular to a heating device based on electromagnetic induction. Background technique [0002] In the field of thin film material growth and preparation, metal organic chemical vapor deposition (MOCVD) equipment is one of the key equipment for the epitaxial growth of compound semiconductor thin film materials, especially suitable for large-scale production in the semiconductor industry. The most important equipment for compound semiconductors such as indium, gallium arsenide, and zinc oxide. [0003] During the growth process of thin film materials, various chemical reactions occur on the substrate under high temperature conditions to form thin film materials. The substrate sheet is placed on the tray carrying the substrate sheet. By heating the tray to raise the temperature, the heat is transferred to the substrate sheet in the form of heat conduction to realize the heating of the substrate sheet. Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/46
CPCC23C16/46
Inventor 王晓亮梅书哲王权殷海波姜丽娟肖红领李巍
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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