Solder paste special for welding SMD diode

A solder paste and diode technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of many residues, poor solderability, weak solder paste activity, etc., to ensure welding quality and inhibit oxidation. , the effect of improving antioxidant properties

Inactive Publication Date: 2018-01-09
RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of its soft effect, the corrosiveness it brings is extremely small, and generally does not cause major harm. However, the prepared solder paste has weak activity and poor solderability, which is easy to cause virtual soldering.
2. There are many residues after welding
As a

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] The special solder paste for chip diode welding in this embodiment, the solder paste is composed of the following components by weight: 10 parts of tin-bismuth alloy solder powder, 60 parts of Sn-Ag-Cu series solder powder, and 2 parts of nano-titanium particles , 4 parts of graphene, 6 parts of phenolic resin, 1 part of malonic acid, 0.5 part of lactic acid, 0.5 part of benzoic acid, 6 parts of n-butyl lactate, 5 parts of ethylene glycol, 1.5 parts of alcohol polyoxyethylene ether and nitro 1 part methane.

Embodiment 2

[0014] The special solder paste for chip diode welding in this embodiment, the solder paste is composed of the following components by weight: 20 parts of tin-bismuth alloy solder powder, 80 parts of Sn-Ag-Cu series solder powder, and 4 parts of nano-titanium particles , 6 parts of graphene, 10 parts of phenolic alcohol resin, 3 parts of malonic acid, 1.5 parts of lactic acid, 1.5 parts of benzoic acid, 12 parts of n-butyl lactate, 15 parts of ethylene glycol, 2.5 parts of alcohol polyoxyethylene ether and nitro 3 parts methane.

Embodiment 3

[0016] The special solder paste for chip diode welding in this embodiment, the solder paste is composed of the following components by weight: 14 parts of tin-bismuth alloy solder powder, 65 parts of Sn-Ag-Cu series solder powder, and 2.5 parts of nano-titanium particles , 4.5 parts of graphene, 7 parts of phenolic resin, 1.5 parts of malonic acid, 0.8 parts of lactic acid, 0.8 parts of benzoic acid, 8 parts of n-butyl lactate, 9 parts of ethylene glycol, 1.9 parts of alcohol polyoxyethylene ether and nitro 1.5 parts of methane.

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PUM

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Abstract

The invention relates to solder paste special for welding an SMD diode. The solder paste is prepared from, by weight, 10-20 parts of tin-bismuth alloy solder powder, 60-80 parts of Sn-Ag-Cu series solder powder, 2-4 parts of nano titanium particles, 4-6 parts of graphene, 6-10 parts of phenolic alcohol resin, 1-3 parts of malonic acid, 0.5-1.5 parts of lactic acid, 0.5-1.5 parts of benzoic acid, 6-12 parts of n-butyl lactate, 5-15 parts of ethylene glycol, 1.5-2.5 parts of polyoxyethylene ether and 1-3 parts of nitromethane. The solder paste special for welding the SMD diode has the advantagesthat through the components and the proper proportion of the solder paste, the welding quality can be effectively ensured through the solder paste, and thus the solder paste can be applied to electronic devices effectively.

Description

technical field [0001] The invention relates to a solder paste, in particular to a special solder paste for patch diode welding. Background technique [0002] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. [0003] Solder paste is widely used in high-precision electronic components. On the one hand, solder paste can isolate electronic components from the air, thereby achieving isolation and preventing oxidation; on the other hand, solder paste can ensure strong soldering performance of electronic components. , so as to achieve high r...

Claims

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Application Information

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IPC IPC(8): B23K35/22
Inventor 曹建民
Owner RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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