Solder paste special for welding SMD diode

Abstract

The invention relates to solder paste special for welding an SMD diode. The solder paste is prepared from, by weight, 10-20 parts of tin-bismuth alloy solder powder, 60-80 parts of Sn-Ag-Cu series solder powder, 2-4 parts of nano titanium particles, 4-6 parts of graphene, 6-10 parts of phenolic alcohol resin, 1-3 parts of malonic acid, 0.5-1.5 parts of lactic acid, 0.5-1.5 parts of benzoic acid, 6-12 parts of n-butyl lactate, 5-15 parts of ethylene glycol, 1.5-2.5 parts of polyoxyethylene ether and 1-3 parts of nitromethane. The solder paste special for welding the SMD diode has the advantagesthat through the components and the proper proportion of the solder paste, the welding quality can be effectively ensured through the solder paste, and thus the solder paste can be applied to electronic devices effectively.

Description

technical field [0001] The invention relates to a solder paste, in particular to a special solder paste for patch diode welding. Background technique [0002] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. [0003] Solder paste is widely used in high-precision electronic components. On the one hand, solder paste can isolate electronic components from the air, thereby achieving isolation and preventing oxidation; on the other hand, solder paste can ensure strong soldering performance of electronic components. , so as to achieve high r...

AI Technical Summary

Problems solved by technology

Because of its soft effect, the corrosiveness it brings is extremely small, and generally does not cause major harm. However, the prepared solder paste has weak activity and poor solderability, which is easy to cause virtual soldering.

2. There are many residues after welding

As a result, when the printed board assembly heats up rapidly during soldering and heating, the solvent in the solder paste cannot be completely evaporated and a large amount of residue is formed after soldering. Not only the appearance is not good, but also sticky

3. Poor thixotropy