Micro-electronic assembly soldering paste and preparation method thereof

A technology of assembly welding and microelectronics, which is applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of affecting welding effect, electrical and thermal conductivity, affecting welding quality, and inability to uniform coating, so as to improve oxidation resistance, The effect of good environmental protection properties and consistent welding results

Inactive Publication Date: 2021-10-19
江苏三沃电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current solder paste can play a certain role in welding, but in order to improve its thermal conductivity and prevent the temperature from being too high, graphene will be added to the raw materials to improve its corresponding performance, but graphene is prone to agglomeration. Uneven distribution will affect the welding effect and electrical and thermal conductivity; at the same time, if the overall solder paste cannot be evenly coated, it will also affect the welding quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A microelectronic assembly solder paste, comprising tin powder and flux, the weight ratio of the tin powder to the flux is 87.7:10.8, and the tin powder comprises the following components in parts by weight: 83 parts of tin, 1.5 parts of silver , 1.5 parts of copper, 1 part of nano-titanium particles, 1.2 parts of graphene, 0.5 part of graphene dispersant PVP; the flux includes the following components in parts by weight: 5 parts of hydrogenated rosin resin, 3.5 parts of ethylene glycol, butyl 1 part of diacid, 0.2 part of polyamide wax, 0.4 part of 4-dimethyl-6-tert-butylphenol, 0.7 part of solder paste dispersant EB-7.

[0022] Its preparation method is: put hydrogenated rosin resin and ethylene glycol into the reaction kettle, heat to 150°C, stir for 30 minutes, cool down to 85°C, add succinic acid, polyamide wax, 4-dimethyl-6-tert-butyl Base phenol and solder paste dispersant EB, stirred for 40min, down to room temperature, to obtain soldering flux; graphene was pla...

Embodiment 2

[0024] A microelectronic assembly solder paste, comprising tin powder and flux, the weight ratio of the tin powder to the flux is 90.3:12.2, and the tin powder comprises the following components in parts by weight: 85 parts of tin, 1.2 parts of silver , 1.8 parts of copper, 1.5 parts of nano-titanium particles, 1.5 parts of graphene, 0.8 parts of graphene dispersant PVP; the flux comprises the following components in parts by weight: 4 parts of pentaerythritol rosin ester, 5 parts of ethylene glycol, hexyl 1.6 parts of diacid, 0.3 parts of polyamide wax, 0.5 parts of N,N'-di-sec-butyl-p-phenylenediamine, 0.8 parts of solder paste dispersant EB-7.

[0025] The preparation method is as follows: put pentaerythritol rosin ester and ethylene glycol into a reaction kettle, heat to 130°C, stir for 35 minutes, cool down to 90°C, add adipic acid, polyamide wax, N,N'-di-sec-butyl p- Phenylenediamine and solder paste dispersant EB-7, stirred for 40 minutes, cooled to room temperature, to...

Embodiment 3

[0027] A microelectronic assembly solder paste, comprising tin powder and flux, the weight ratio of the tin powder to the flux is 93.8:11.9, and the tin powder comprises the following components in parts by weight: 88 parts of tin, 1.8 parts of silver , 2 parts of copper, 1.3 parts of graphene, 0.7 part of graphene dispersant PVP; Described flux comprises following components by weight part: 4.5 parts of hydrogenated rosin resins, 4.5 parts of diethylene glycol dimethyl ether, adipic acid 1.2 parts, 0.5 parts of stearic acid amide, 0.2 parts of N,N'-di-sec-butyl-p-phenylenediamine, 1 parts of solder paste dispersant EB-7.

[0028] The preparation method is as follows: put hydrogenated rosin resin and diethylene glycol dimethyl ether into the reaction kettle, heat to 120°C, stir for 40 minutes, cool down to 80°C, add adipic acid, stearic acid amide, N,N'- Di-sec-butyl-p-phenylenediamine and solder paste dispersant EB-7 were stirred for 40 minutes and cooled to room temperature ...

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PUM

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Abstract

The invention discloses micro-electronic assembly soldering paste and a preparation method thereof. The soldering paste comprises tin powder and soldering flux, the weight ratio of the tin powder to the soldering flux is (82-95): (8-15), and the tin powder comprises the following components in parts by weight: 80-90 parts of tin, 1-2 parts of silver, 1.5-2 parts of copper, 0-1.5 parts of nano titanium particles, 0.5-1.5 parts of graphene and 0.5-1 part of a graphene dispersing agent; the soldering flux comprises the following components in parts by weight: 4-6 parts of rosin, 3-5 parts of a solvent, 0.8-2 parts of an activating agent, 0.2-0.5 part of a thixotropic agent, 0.1-0.5 part of an antioxidant and 0.5-1 part of a solder paste dispersing agent. Graphene can be uniformly dispersed in tin powder through the graphene dispersing agent, the phenomenon that the graphene is agglomerated when the tin powder and the soldering flux are mixed is prevented, the dispersion uniformity of the graphene in the whole soldering paste system is improved, and the uniform and same heat dissipation performance can be kept on the whole after soldering.

Description

technical field [0001] The invention relates to the technical field of solder paste processing, in particular to a microelectronic assembly solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. [0003] The current solder paste can play a certain role in welding, but in order to improve its thermal conductivity and prevent the temperature from being too high, graphene will be added to the raw materials to improve its corresponding performance, but graphene is prone ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/262B23K35/362B23K35/3612B23K35/025
Inventor 肖大为卢克胜张青山
Owner 江苏三沃电子科技有限公司
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