Polyimide film, and preparation method and application thereof

A polyimide film, polyimide technology, used in chemical instruments and methods, layered products, metal layered products, etc., can solve the flexibility or life limit of circuit boards, polyimide and copper The problems of poor foil adhesion and large difference in linear expansion coefficients can achieve the effects of excellent adhesion, excellent flexibility, and excellent film-forming properties.

Inactive Publication Date: 2018-01-09
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, one disadvantage of polyimide flexible circuit boards is that the adhesion between polyimide and copper foil is poor, and it is necessary to use an adhesive layer
However, the traditional adhesive layer is epoxy resin or acrylic resin, which has poor heat resistance and toughness, and has a large difference in linear expansion coefficient with the substrate, so the flexibility and life of the circuit board are limited.

Method used

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  • Polyimide film, and preparation method and application thereof
  • Polyimide film, and preparation method and application thereof
  • Polyimide film, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A kind of polyimide film, its preparation method comprises the steps:

[0043] 1) Synthesis of polyamic acid (PAA) solution: Carry out according to the molar ratio of BTDA:ODA:DAPBI=5:1:4, first add two kinds of diamine monomers ODA and DAPBI with a molar ratio of 1:4 into the metered In DMAc, make the total solid content 15%, then mechanically stir under the protection of nitrogen, then add BTDA which is equimolar to the total amount of the two diamines in batches, and make it continue to react for 5 hours below 25 ° C in a nitrogen atmosphere to obtain Viscous polyamic acid solution. The polyamic acid solution was sealed and placed in the refrigerator for use, and its viscosity was measured to be 5.3 Pa·s after 24 hours.

[0044] 2) Preparation of polyimide film: cast the PAA solution prepared in step 1) on a clean glass plate to form a film, keep it in a blast oven at 60°C for 30min, at 100°C for 30min, and at 150°C for 30min, then Continue in the vacuum oven, keep...

Embodiment 2

[0053] A polyimide copper clad laminate, such as image 3 As shown, it includes a copper foil layer and a polyimide layer located on the copper foil layer, wherein the thickness of the copper foil layer is 13 μm, and the thickness of the polyimide layer is 20 μm; its preparation includes the following steps:

[0054] The PAA solution prepared in Example 1 was spin-coated on the copper foil, and then the thermal imidization process was completed using the same thermal imidization process as in Example 1 to obtain a polyimide copper-clad laminate.

[0055] The polyimide copper-clad laminate in this embodiment has very good flatness, and the polyimide layer and the copper foil layer have very good adhesion performance, see FIG. 2(b) and FIG. 2(c). Take a polyimide copper-clad laminate with a width of 0.5cm and a length of 5cm to conduct a peel performance test. The curve is as follows Figure 4 As shown, the warpage of the copper clad laminate is 3.0 mm, and the T-peel strength ...

Embodiment 3

[0057] A kind of polyimide film, its preparation method comprises the steps:

[0058] 1) Synthesis of polyamic acid solution: Carry out according to the molar ratio of BTDA:ODA:DAPBI=4:1:3, firstly add ODA and DAPBI two diamine monomers with a molar ratio of 1:3 into the metered DMAc, Make the total solid content 15%, then mechanically stir under the protection of nitrogen, then add BTDA which is equimolar to the total amount of the two diamines in batches, and continue to react for 5 hours under the nitrogen atmosphere below 25°C to obtain viscous Polyamic acid solution. The polyamic acid solution was sealed and placed in a refrigerator for use, and its viscosity was measured to be 5.0 Pa·s after 24 hours.

[0059] 2) Preparation of polyimide film: cast the PAA solution prepared in step 1) on a clean glass plate to form a film, keep it in a blast oven at 60°C for 30min, at 100°C for 30min, and at 150°C for 30min, then Continue in the vacuum oven, keep at 250°C for 20min, at...

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Abstract

The invention discloses a polyimide film. The glass transition temperature is 360 to 380 DEG C, the tensile strength is 200 to 220 MPa, and the average linear expansion coefficient within the range of50 to 300 DEG C is 18 to 20 ppm/K; the chemical component of the polyimide film is polyimide, and the structural formula of the polyimide is as shown in the following formula I (the formula I is as shown in the description), wherein n and m represent the polymerization degree of the polymer, m to n is 3-1 to 17-3, and n is an arbitrary positive integer. The polyimide has excellent film-forming characteristic, the polyimide film has superhigh heat resistance and mechanical strength, particularly the polyimide film has the average linear expansion coefficient nearly close to that of a copper foil within a certain high temperature range.

Description

technical field [0001] The invention relates to the technical field of polyimide membranes. More specifically, it relates to a polyimide film and its preparation method and application. Background technique [0002] Flexible circuit board is a kind of flexible printed circuit board, which has the characteristics of high wiring density, light weight, small size, thin thickness and good bendability. At present, communication equipment, consumer electronics products, computers and other related products are the three largest application fields of flexible circuit boards, accounting for about 80% of the total market demand. In recent years, mobile electronic devices and wearable smart devices have also expanded the development space of flexible circuit boards. [0003] Because polyimide has excellent properties such as high heat resistance, high strength, high modulus, and high dimensional stability, it has been widely used in flexible circuits as an insulating layer. However...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10B32B15/20B32B15/08B32B27/28H05K3/38
Inventor 于晓慧吴大勇操建华梁卫华
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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