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Preparation method of mushroom-shaped metal column array surface with stratum structure

A technology of metal surface and metal pillars, which is applied in the field of preparing the surface of mushroom-shaped metal pillar arrays with a hierarchical structure, can solve the problems of poor mechanical strength, short service life, and inability to meet long-term use, and achieve strong durability and high mechanical strength , Expand the effect of the application field

Active Publication Date: 2018-01-12
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the existing methods involve expensive instruments and equipment or complicated process flow, and are difficult to be used for the preparation of large-area super-wetting surfaces. It is easily affected by external factors such as light and temperature, and cannot meet the requirements of long-term use

Method used

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  • Preparation method of mushroom-shaped metal column array surface with stratum structure
  • Preparation method of mushroom-shaped metal column array surface with stratum structure
  • Preparation method of mushroom-shaped metal column array surface with stratum structure

Examples

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Effect test

Embodiment 1

[0033] A 100nm thick titanium film and a 20nm thick gold film were sequentially deposited on a single crystal silicon wafer, and a polycarbonate porous membrane with a pore size of 12 μm (thickness 14 μm) and a polycarbonate porous membrane with a pore size of 400 nm (thickness 20 μm) were sequentially deposited. Covered on the surface of the silicon substrate. Take an appropriate amount of silver electroplating solution and add it to the electroplating tank, immerse the anode platinum electrode and the reference electrode in the electroplating solution, use the workpiece as the cathode, and use the double-layer polycarbonate film as the mask, adopt the constant current silver electroplating process, the current is 10mA, The electroplating time is 35 minutes, and an array of mushroom-shaped silver metal pillars with a hierarchical structure is electroplated and grown on the surface. After the set time is reached, the constant current meter is turned off, and the plated samples...

Embodiment 2

[0035] A 100nm thick titanium film and a 20nm thick gold film were sequentially deposited on a single crystal silicon wafer, and a polycarbonate porous membrane with a pore diameter of 5 μm (thickness 10 μm) and a polycarbonate porous membrane with a pore diameter of 500 nm (thickness 10 μm) were sequentially deposited. Covered on the surface of the silicon substrate. Take an appropriate amount of copper electroplating solution and add it to the electroplating tank, immerse the anode platinum electrode and the reference electrode in the electroplating solution, use the workpiece as the cathode, and use the double-layer polycarbonate film as the mask, adopt the constant potential copper electroplating process, and the current is 19mA, The electroplating time is 20 minutes, and an array of mushroom-shaped copper metal pillars with a hierarchical structure is electroplated and grown on the surface. After the set time is reached, the constant current meter is turned off, and the p...

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Abstract

The invention relates to a preparation method of a mushroom-shaped metal column array surface with a stratum structure. According to the preparation method, with a double-layer polycarbonate film withnano-holes and micron holes as a mold plate, a mushroom-shaped metal column array with the micro-nano stratum structure is prepared on the metal surface through an electroplating process. The mushroom-shaped metal column array has superhydrophobic performance after surface fluorination. According to the method, no expensive instrument equipment or complicated process procedures are needed, the method is simple and economical, the prepared surface micro structure is high in mechanical strength and high in durability, and the application field of super moistened surfaces can be extremely widened.

Description

technical field [0001] The invention relates to the field of material preparation, in particular to a method for preparing a mushroom-shaped metal pillar array surface with a hierarchical structure. Background technique [0002] In recent years, superhydrophobic surfaces with water contact angles larger than 150° have attracted great attention because of their extremely important application prospects in many fields such as self-cleaning materials, microfluidic devices, and biomaterials. The surface of some plant leaves in nature, the most typical one is the surface of lotus leaf, which has superhydrophobic properties and self-cleaning function (lotus leaf effect). In 1997, botanist Bartlott of the University of Bonn in Germany and other researchers studied the leaf surfaces of nearly 300 kinds of plants, and believed that this self-cleaning characteristic was caused by micron-structured papillae on the rough surface and hydrophobic waxy materials on the surface. caused joi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02B82Y40/00
Inventor 于庆杰王放
Owner HUAQIAO UNIVERSITY
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