Phase-change material based heat radiator

Abstract

The invention relates to a phase-change material based heat radiator. The heat radiator comprises a phase-change device, at least one heat pipe, a plurality of radiating fins and a fan. The phase-change device comprises an outer shell and an inner cavity in the outer shell, and the inner cavity is used for filling of a phase-change material. The outer shell is provided with via holes outside the inner cavity, each heat pipe comprises a heat absorption section and a heat release section, each heat absorption section penetrates the corresponding via hole, and each heat release section extends upwards. The radiating fins sleeve the heat release sections of the heat pipes, and the fan is mounted on one side of the radiating fins. The phase-change material based heat radiator is high in airtightness, heat radiation performance and heat radiation stability, operating time of electronic components such as a CPU (central processing unit) can be prolonged, reliability and stability in operationof the electronic components are improved, and service lives of the electronic components are prolonged.

Description

Technical field [0001] The invention relates to the field of electronic temperature control, and in particular to a heat sink based on a phase change material for CPU heat dissipation. Background technique [0002] The central processing unit (CPU) is the core electronic component of the computer. As people's demand for computer computing power increases, the CPU computing load is also increasing. At present, the power consumption of computer CPU has reached about 80W, and the surface heat flux density is as high as 10 4 ~10 5 W / m 2 . High-power, high-frequency calculations cause the CPU temperature to rise, shorten the life of the CPU, and reduce the performance of the CPU. [0003] The phase change material is accompanied by a large amount of phase change latent heat in the phase change process, which can absorb or release a large amount of energy and the phase change process is approximately isothermal. Using the characteristics of phase change materials can realize the tempera...

AI Technical Summary

Problems solved by technology

[0006] Chinese patent application CN201610067053 discloses an integrated heat sink based on metal phase change materials and heat pipes. In this device, the metal phase change materials and heat pipes are embedded together, and the heat-absorbing end of the heat pipes passes through the cavity containing the phase change materials. body, so that the cavity is not tightly sealed, resulting in the easy leakage of the metal phase change material; in the case of the cavity containing the phase change material, it is easy to destroy the properties of the internal phase change material during welding during the manufacturing or maintenance process, resulting in The performance of the phase change material is degraded; the metal phase change material is corrosive, and the direct contact between the heat pipe and the phase change material will easily cause corrosion of the heat pipe and shorten the service life of the radiator. Although the inner surface of the cavity and the outer surface of the heat pipe can be coated or Oxidation treatment can prevent the cavity or heat pipe from being corroded by low melting point metal to a certain extent, but this will increase the production process and increase the production cost, and the material of the heat pipe shell is generally copper, and the surface treatment process of copper is complicated; The exothermic end is interspersed in the phase change material, and the heat pipe will quickly and efficiently transfer the absorbed heat to the interior of the entire phase change material instead of directly dissipating it into the air, which increases the heat absorption burden of the phase change material; the phase change material melts Previously, heat would be stored in the phase change material for a short period of time and could not be dissipated into the air, even if fins were installed on the outside of the heat pipe (the fins were also placed in the cavity and not in direct contact with the external environment) and outside the cavity Adding heat dissipation fins to assist heat dissipation will inevitably cause heat dissipation pressure to the phase change material, making the heat dissipation of the phase change material unstable, and there is a hidden danger of causing the temperature of the heat source to be too high, which may easily cause unreliable or unstable operation of electronic components

Images