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Mold cleaning compound and method for cleaning semiconductor packaging mold

A compound and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of not being able to clean the inside of the injection barrel and nozzle, and achieve excellent workability and cleaning performance. Eliminates stickiness and prevents tangles

Inactive Publication Date: 2018-01-12
FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For injection molding, the inside of the injection barrel and nozzle cannot be cleaned

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7 and comparative example 1-6

[0070] Raw Material: Rubber

[0071] Rubber 1 (natural rubber): high butadiene rubber

[0072] Rubber 2 (synthetic rubber): ethylene-propylene-diene rubber (EPDM)

[0073] Raw material: Viscosity reducer at room temperature

[0074] Cross-linking * Thermoplastic Rubber 1: Styrene-Butadiene Block Copolymer (LG Ghem, LG401: Styrene 20% by weight, Density 0.93kg / cc, Hardness 57 Shore A)

[0075] Cross-linking * Thermoplastic rubber 2: thermoplastic polybutadiene rubber (1,2-PB) (JSR, RB820: density: 0.91g / cc, DSC melting point 95°C)

[0076] non-crosslinking * Thermoplastic Rubber 1: Thermoplastic Polyurethane (TPU) (Dongsung Highchem, 5075A: Hardness 75 Shore A, Softening Point 75°C)

[0077] Cross-linking * Resin 1: ethylene vinyl acetate (EVA) (Hanhwa Chem, EVA 1317: vinyl acetate 21% by weight, MI 2.5, DSC melting point: 81° C.)

[0078] Cross-linking * Resin 2: High-density polyethylene (HDPE) (LG Chem, BE0350: Density: 0.96g / cc, DSC melting point: 134°C)

[0079]...

experiment example 1～3

[0109] A mold cleaning compound and its granules were prepared in the same manner as in Example 1 except that the composition was changed as shown in Table 1. Evaluate whether the mold cleaning compound is processed by underwater cutting and face cutting. Observe the shape of the particles and measure the physical properties of the particles. The results are shown in Table 3.

[0110] table 3

[0111] Additional experiment number

1

2

3

Rubber 1**

48

48

Rubber 2**

48

48

Cross-linked thermoplastic rubber1**

4

Cross-linked thermoplastic rubber 2**

Non-crosslinkable thermoplastic rubber1**

Cross-linking resin1**

4

100

Cross-linking resin 2**

Cross-linking resin 3**

Non-crosslinkable resin1**

Stearic acid***

1.0

1.0

1.0

Zinc oxide***

5.0

5.0

5.0

DCP***

2.0

...

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Abstract

Provided are: a mold cleaning compound, which is a compound for cleaning a semiconductor packaging mold and has a spheroidal or cylindrical shape; and a mold cleaning method using the same.

Description

technical field [0001] The present disclosure relates to a mold cleaning compound and method for cleaning semiconductor packaging molds. More particularly, the present disclosure relates to a mold cleaning compound capable of simply and effectively cleaning a semiconductor packaging mold and a method for cleaning a semiconductor packaging mold. Background technique [0002] Highly integrated semiconductor devices produced by advanced semiconductor thin-film technology are very sensitive to external environmental factors such as humidity and temperature, and have poor resistance to external shocks. Due to these disadvantages, semiconductor devices need to be packaged. The package protects the semiconductor device and enables the semiconductor device to input / output signals from / to external devices. [0003] Generally, semiconductor devices are packaged through a series of processes including die attach, wire bonding, and molding. Die attach is a process for tiling a semico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L9/00C08L23/16C08L53/02C08L23/08C08L23/06C08K13/02C08K5/09C08K5/17C08K5/06C08K3/36H01L21/56B29C33/72
CPCB29C33/72H01L21/02H01L23/29H01L23/31
Inventor 李成栗
Owner FINE CHEM
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