Nerve stimulator device
A nerve stimulation and neuron technology, applied in the field of biomedical engineering, can solve the problems of large surgical implant opening, large wiring width, and large trauma surface, and achieve the effects of short production cycle, large opening and simple method
Inactive Publication Date: 2018-01-16
徐文敏
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Problems solved by technology
[0005] For this reason, the technical problem to be solved by the present invention is the neural stimulator of the prior art, the microelectrode of the neural stimulator is connected with the stimulation chip by wires, which causes the wiring width to be large, the surgical implantation opening to be large, and the problem that the wound surface is large, and then Propose a neurostimulator device
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[0020] A neurostimulator such as figure 1 As shown, a substrate 1 is included, and several through holes are opened; microelectrodes 2, several, are used to stimulate neurons; Stimulation part 7, the other side is the connection part 6 of microelectrode 2; Stimulation chip 3, is used to control described microelectrode 2 to send stimulation signal to neuron and receive feedback signal; The connection part 6 of described microelectrode 2 directly inverts Mounted and welded on the stimulation chip 3; the shell 4 is hermetically connected to the substrate 1 and forms a cavity with the substrate 1 for packaging the connection part 6 of the microelectrode 2 and the stimulation chip 3.
[0021] Above-mentioned technical scheme is the core technical scheme of the present invention, and the microelectrode 1 of nerve stimulator is connected with stimulating chip 3 by flip-chip welding process, has avoided using the wire that connects microelectrode 2 and stimulating chip 3, has reduced...
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The invention belongs to the technical field of biomedical engineering, and specifically relates to a nerve stimulator device. The device comprises a pedestal which is provided with a plurality of through holes; a plurality of microelectrodes which are disposed on the substrate in a manner that the microelectrodes are disposed in the through holes, wherein the parts exposed at one side of the substrate serve as the stimulation parts of the microelectrodes, and the parts exposed at the other side of the substrate serve as the connection parts of the microelectrodes; a stimulation chip, whereinthe connection parts of the microelectrodes are directly disposed on the stimulation chip in a manner of flip-chip bonding; and a housing which is connected to the substrate in a sealed manner. A manufacturing method employs the technologies of laser drilling and electroplating drilling, and employs a packaging mode of laser welding. The microelectrodes are connected with the stimulation chip through the flip-chip bonding technology, thereby greatly reducing the tissue damages caused in an implantation process of a stimulator. The manufacturing method is simple in process, and is short in period. The device achieves the high-density selective stimulation and recording for high-density and ordered implantable three-dimensional electrode arrays, and is good in application prospect.
Description
technical field [0001] The invention belongs to the technical field of biomedical engineering, and in particular relates to a nerve stimulator device. Background technique [0002] Implantable neurostimulators have a wide range of applications in medicine, such as cochlear implants, artificial vision restoration, and deep brain stimulation systems. As an important tool to reveal the working mechanism of the nervous system and treat neurological diseases, microelectrodes have attracted more and more attention, and have become an important research direction at present. [0003] The application of microelectrodes is usually to implant microelectrodes into animals or patients, to stimulate or inhibit neural activity by loading electrical signals, or to convert neural activity into electrical signals and record them for research. Due to different targets, various microelectrode arrays based on micromachining technology have been developed. Among them, high-density, orderly arr...
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IPC IPC(8): A61N1/36A61N1/05
Inventor 徐文敏
Owner 徐文敏