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Mask plate and method for manufacturing mask plate

A mask and mask technology, used in semiconductor/solid-state device manufacturing, ion implantation plating, coating, etc., can solve problems affecting the flat state of the effective area of ​​evaporation, surface wrinkles, affecting the quality of evaporated products, etc. The effect of improving the flat state, improving the wrinkle state, and improving the yield

Active Publication Date: 2018-01-30
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fine metal mask (FMM Sheet) will have wrinkles on the surface after stretching, which will affect the flatness of the evaporation effective area, and then affect the quality of the evaporation product

Method used

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  • Mask plate and method for manufacturing mask plate
  • Mask plate and method for manufacturing mask plate

Examples

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Embodiment Construction

[0027] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, devices, steps, etc. may be adopted. In other instances, well-known technical solution...

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Abstract

The invention relates to a mask plate and a method for manufacturing the mask plate, and relates to the technical field of display. The mask plate comprises a plurality of mask units, and each mask unit comprises a vapor deposition active area and a plurality of welding areas distributed at the periphery of the vapor deposition effective area according to a preset rule, and the welding areas at peripheries of the vapor deposition active areas of the mask units located in the edge area of the mask plate and the mask units located inside the mask plate are consistent in distribution. The mask plate not only can facilitate the improvement in a folding state of the mask units at the central area of the mask plate, but also improves the folding state of the mask units at the edge area of the mask plate to improve the folding state of the entire mask plate and further improve a flat state of the surface of the mask plate, so that the quality of deposited products is improved and the yield ofthe deposited product is increased.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a mask and a method for manufacturing the mask. Background technique [0002] With the development of optical technology and semiconductor technology, flat panel displays represented by liquid crystal display (Liquid Crystal Display, LCD) and organic light emitting diode display (Organic Light Emitting Diode, OLED) have the advantages of light and thin, low energy consumption, fast response speed, color The characteristics of good purity and high contrast ratio occupy a dominant position in the display field. Among them, in the semiconductor manufacturing process, the photolithography process is a very important link, and the main function of the photolithography process is to copy the pattern on the mask plate to the silicon wafer, so as to prepare for the next etching or ion implantation process. . [0003] In the mask manufacturing process, such as the fine me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/24H01L51/56H10K99/00
CPCC23C14/042H10K71/166H10K71/00H10K71/164
Inventor 林治明黄俊杰张健白音必力郝志元辛小林张德刘旭张新建
Owner BOE TECH GRP CO LTD
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