Organosilicon compound and manufacturing method thereof, and curable composition

An organosilicon compound and a manufacturing method technology, applied in chemical instruments and methods, other household appliances, electronic equipment, etc., can solve the problem of insufficient adhesion between resin materials and copper foil, and achieve the effect of excellent dielectric properties

Active Publication Date: 2018-02-06
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the production method of the compound of Patent Document 1, the alkoxysilyl group which has the highest reactivity and contributes to the improvement of the adhesion is consumed in the dealcoholization condensation reaction, so the resin material and the copper foil The tightness is not enough

Method used

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  • Organosilicon compound and manufacturing method thereof, and curable composition
  • Organosilicon compound and manufacturing method thereof, and curable composition
  • Organosilicon compound and manufacturing method thereof, and curable composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0173] [Example 1-1] Synthesis of organosilicon compound 1

[0174] Into a 200 mL detachable flask equipped with a stirrer, a reflux condenser, a dropping funnel, and a thermometer, 40 g of PPO (trademark) SA120-100 (manufactured by SABIC Innovative Plastics), 110 g of toluene, and 0.05 g, heated to 80°C. 7.6 g of 3-isocyanatopropyl trimethoxysilane was added dropwise thereto, and it heated and stirred at 80 degreeC for 2 hours. It was confirmed by IR measurement that the absorption peak derived from the isocyanate group of the raw material completely disappeared, and an absorption peak derived from a urethane bond was generated instead, and the reaction was considered to be complete.

[0175] The obtained reaction product is a brown transparent liquid with a weight average molecular weight of 6,700 and a viscosity of 23mm 2 / s, and the non-volatile content was 34% by mass.

Embodiment 1-2

[0176] [Example 1-2] Synthesis of organosilicon compound 2

[0177] It synthesized by the same procedure as Example 1-1 except having changed the quantity of 3-isocyanatopropyl triethoxysilane into 9.2 g.

[0178] The obtained reaction product is a brown transparent liquid with a weight average molecular weight of 6,800 and a viscosity of 30 mm 2 / s, and the non-volatile content was 30% by mass.

Embodiment 1-3

[0179] [Example 1-3] Synthesis of organosilicon compound 3

[0180] Except having changed the quantity of toluene into 120g and the quantity of 3-isocyanatopropyl trimethoxysilane into 11.1g, it synthesize|combined by the procedure similar to Example 1-1.

[0181] The obtained reaction product is a brown transparent liquid with a weight average molecular weight of 5,300 and a viscosity of 21 mm 2 / s, and the non-volatile content was 29% by mass.

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Abstract

The invention relates to an organosilicon compound and a manufacturing method thereof, and a curable composition, namely provides an effective organosilicon compound as a resin modifying agent of a high-frequency substrate material, a manufacturing method thereof, and a curable composition including the organosilicon compound. The organosilicon compound is characterized in that the compound is represented by an average structural formula (1). In the formula, X represents an organic group containing an n-valent polyphenylene oxide structure, R1 mutually represents an unsubstituted or substituted C1-C10 alkyl group or an unsubstituted or substituted C6-C10 aryl group, R2 mutually represents an unsubstituted or substituted C1-C10 alkyl group or an unsubstituted or substituted C6-C10 aryl group, A1 represents a single-bond linking group or a bivalent heteroatom-containing linking group, A2 represents a bivalent unsubstituted or substituted C1-C20 hydrocarbyl group without containing hereroatom, m is a number of 1-3, and n is a number of 1-10.

Description

technical field [0001] The present invention relates to an organosilicon compound, a method for producing the same, and a curable composition. More specifically, it relates to an organosilicon compound having a polyphenylene ether structure and a hydrolyzable group in its molecule, a method for producing the same, and a compound containing the organosilicon compound. Curable composition and its cured article. Background technique [0002] A silane coupling agent is a compound containing both a moiety (a hydrolyzable group bonded to a Si atom) and a moiety rich in reactivity and solubility to an organic substance in one molecule. It acts as an adhesion aid at the interface between substances and organic substances, so it is widely used as a modifier for composite resins. [0003] In addition, it is known that polyphenylene ether compounds have high heat resistance and are excellent in dielectric properties such as dielectric constant and dielectric loss tangent, especially i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08L63/00C08L71/12B32B15/092
CPCC08G65/485C08L63/00B32B15/092B32B2260/046B32B2260/021B32B2457/08C08L2205/025C08L2205/03C08L2203/20C08L71/12C08G65/336C08G77/46
Inventor 山田哲郎广神宗直
Owner SHIN ETSU CHEM IND CO LTD
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