Unlock instant, AI-driven research and patent intelligence for your innovation.

High-radiation LED filament

A technology of LED filament and LED lamp, which is applied to the cooling/heating device of lighting device, lighting device, lighting and heating equipment, etc., can solve the problem of poor radiation ability of thermal substrate, little contribution to heat dissipation of filament lamp system, unsatisfactory effect, etc. problem, to achieve the effect of improving the heat dissipation capacity

Pending Publication Date: 2018-02-06
SHANGHAI LATRONIX TECH CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal radiation coefficient of the smooth silver coating is very small, and the surface thermal radiation coefficient (emissivity) is defined as the highest 1, and the worst is 0, then the thermal radiation coefficient of the smooth silver coating is only 0.02-0.05, which leads to the radiation of the thermally conductive substrate. very poor ability
Therefore, the thermal radiation and heat dissipation ability of the metal-based filament is also very poor at present. Although the back of the metal-based filament has a large radiation area, its radiation heat dissipation contributes little to the heat dissipation of the filament lamp system.
[0008] In addition, the heat dissipation performance of the LED filament can also be improved by increasing the radiation surface area of ​​the bulb (using a large bulb) or increasing the surface area of ​​the LED filament to increase the probability of gas molecule collisions (thickening the filament), but the effect is not good. ideal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-radiation LED filament
  • High-radiation LED filament
  • High-radiation LED filament

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Metal iron or iron alloy is used as the heat conduction substrate 2, and the heat conduction substrate 2 is placed in an oxidizing environment to form iron oxide through oxidation, thereby increasing the emissivity. In this embodiment, the formed iron oxide is exemplified by ferric iron tetroxide, and its emissivity is greater than 0.74.

Embodiment 2

[0058] Metal iron is used as the heat-conducting substrate 2, and nickel ions and chromium ions are sequentially implanted into the second surface of the heat-conducting substrate 2 by ion implantation to form a nickel-chromium-iron alloy surface with a high emissivity coefficient, and the radiation of the nickel-chromium-iron alloy is The coefficient is greater than 0.8.

Embodiment 3

[0060] 310 austenitic stainless steel (its chemical formula is Ni20Cr25Fe55) is used as the heat-conducting substrate 2, and the second surface of the heat-conducting substrate 2 is subjected to high-temperature oxidation treatment to obtain nickel-chromium-iron alloy oxide, and its emissivity can reach 0.97. Under the same surface area condition, compared with the LED filament in the prior art, its radiation performance is improved by 30-50 times.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a high-radiation LED filament. The high-radiation LED filament comprises a heat conduction substrate, a plurality of LED lamps connected in series are fixed on a first surface of the heat conduction substrate, a high-radiation material layer is formed on a second surface opposite to the first surface, and the high-radiation material layer and the second surface are connectedin a chemical bond manner. According to the high-radiation LED filament, an exposed surface of the heat conduction substrate forms the surface layers connected with the heat conduction substrate in the chemical bond manner through machining or the chemical and physical mode process, the surface layers have high heat radiation coefficients, the heat radiation becomes an effective heat radiation approach of the LED filament, the heat radiation capability of the filament is improved, and the filament is applicable to practical application of higher power.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a high-radiation LED filament. Background technique [0002] The basic form of the current filament light source is to package dozens of LEDs in series on a long heat-conducting substrate. The material of the heat-conducting substrate is generally transparent ceramic or opaque metal. When using transparent ceramics as the heat-conducting substrate, blue light For the leakage problem, the phosphor type must be determined according to the required color temperature parameters of the LED and the chip band, and then mixed with silica gel or acrylic resin to form a light yellow fluorescent glue, and the phosphor glue is applied to the integrated soldered LED blue light chip , which directly converts blue light to white light. Install the prepared LED filament on a copper wire support, and place it together in a transparent or translucent sealed bulb (usually glass) filled with a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/64H01L33/60H01L33/62F21V29/00F21Y115/10
CPCH01L33/60H01L33/62H01L33/64H01L33/641F21V29/00
Inventor 严守平张新辉
Owner SHANGHAI LATRONIX TECH CORP