Transient voltage suppressor and manufacturing method therefor
A technology of transient voltage suppression and manufacturing method, which is applied in the direction of semiconductor/solid-state device parts, circuits, electrical components, etc., and can solve the problems of multi-channel TVS device application field limitations, multiple chips cannot be packaged at the same time, and increase the overall size, etc. , to achieve stable product parameters and performance, high chip area utilization, and reduce processing difficulty
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[0028] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the embodiments of the present invention, some specific details are described in detail, and those skilled in the art can fully understand the present invention without the description of these details. In order to avoid obscuring the essence of the present invention, well-known methods, procedures, and flow charts are not described in detail.
[0029] In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown in the drawings. The flowcharts and block diagrams in the accompanying drawings illustrate the possible system framework, functions and operations of the systems, methods, and devices of the embodiments of the present invention, and the blocks an...
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