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Metal Resin Complex

A metal resin, composite technology, used in metal processing equipment, metal layered products, semiconductor devices, etc., can solve the problems of insufficient bonding strength, increased cost, insufficient heat transfer, etc., and achieve excellent heat release and Moldability and the effect of low-cost manufacturing

Inactive Publication Date: 2018-02-16
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned space becomes thermal resistance, and heat transfer becomes insufficient, so there is room for improvement
In addition, the thermally conductive resin composition has high thermal conductivity, and when the molten resin flows into the mold, the curing speed is fast, so the resin is difficult to flow into the fine recesses on the metal surface caused by the surface treatment, and the joint strength becomes insufficient. question
Therefore, in the case of integrating the metal and the thermally conductive resin composition, it is necessary to use other materials that reduce the thermal resistance at the interface between the metal and the resin, but these materials are generally expensive materials, so there is a problem of increased cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～11

[0288] Use a hot air dryer to dry the thermoplastic resin for 4 hours [drying temperature: (A-1) to (A to 4), (A-6) is 140°C, (A-5) is 120°C], and prepare the following table 2 in the form of the weight ratio shown in Table 2 of the components described in the mixture of the material. 0.3 parts by weight of a phenolic stabilizer (AO-60 manufactured by ADEKA Corporation) and a phosphorus antioxidant (ADK STAB PEP-36 manufactured by ADEKA Corporation) were added thereto at 0.3 parts by weight with respect to 100 parts by weight of the resin composition. Using the 25mm co-rotating fully intermeshed twin-screw extruder MFU25TW-60HG-NH-1300 manufactured by Technovel Co., Ltd., the mixture was set at a discharge rate of 20kg / h and a screw speed of 150rpm, and the temperature of the extrusion barrel was set as shown in Table 1. The mixture was melt-kneaded at the indicated temperature to obtain pellets of the resin composition. The pellets of the obtained resin composition were inje...

Embodiment 12～13

[0290] Using the pellets of the resin composition obtained in Example 4, made Figure 4~6 The heatsink described in. Aluminum alloy plates subjected to treatment 1 or 4 were used, respectively. Using the obtained composite, evaluations of bondability and heat dissipation were performed, and the results are shown in Table 3.

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PUM

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Abstract

Provided is a metal resin complex, in which a heat-conductive resin composition and a surface-treated metal are molded integrally by injection molding to closely adhere the metal to the resin at the interface therebetween, and which has excellent heat-dissipating properties and moldability, is lightweight and can be produced easily. A metal resin complex, in which a member comprising a heat-conductive resin composition and a member comprising a metal having a surface that is treated to form fine recesses thereon are bonded to each other in a contacted state, wherein the bonding of the membersin a contacted state is achieved by flowing the heat-conductive resin composition into the recesses during the ejection molding of the heat-conductive resin composition to fix the members to each other, the heat-conductive resin composition comprises a thermoplastic resin (A) and an inorganic filler (B), the in-plane heat conductivity of the heat-conductive resin composition is 1 W / (mK) or more, and the inorganic filler (B) comprises at least one component selected from the group consisting of the following components (B1) and (B2): (B1) inorganic particles having a heat conductivity of 2 W / (mK) or more and a volume average particle diameter of 1 to 700 mum; and (B2) inorganic fibers having a heat conductivity of 1 W / (mK) or more, a number average fiber diameter of 1 to 50 mum and a numberaverage fiber length of 6 mm or less.

Description

technical field [0001] The present invention relates to a metal-resin composite obtained by integrally molding a thermally conductive resin composition and a surface-treated metal by injection molding. More specifically, it relates to a metal-resin composite that has excellent heat dissipation and moldability and can be lighter than metal. Background technique [0002] With the miniaturization and high integration of electrical / electronic equipment, the heat dissipation of mounting parts and the high temperature of the use environment have become significant, and the demand for improved heat dissipation of manufactured components is increasing. In particular, metals and ceramics with high thermal conductivity are currently used in automotive components and high-power LED heat dissipation components. However, in order to improve weight reduction, processability, and degree of freedom in shape, high thermal conductivity and molding processability are required. Thermally condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B29C45/14H01L33/64C08K3/00C08K7/06C08L101/00
CPCC08K3/00C08K7/06C08L101/00B29K2995/0012H01L2933/0075H01L33/644H01L33/641H01L33/642B29C45/14311B29K2995/0013H01L33/64B32B15/08B29C45/14F21V29/74F21V29/89B23K26/364F21S45/48B29B7/48B29C45/0001B29C45/14336B29K2067/003B29K2067/006B29K2077/00B29K2081/04B29K2105/0026B29K2105/0085B29K2105/16B29K2309/08B29K2507/04B29K2705/02C08J5/043C08J2367/02C08J2377/02C08J2381/02C08K3/04C08K7/14C23F1/20
Inventor 江崎俊朗
Owner KANEKA CORP
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