Heat conduction silicone grease as well as processing method and application thereof

A heat-conducting silicone grease and processing method technology, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of poor heat conduction effect, increased cross-sectional thermal resistance, unfavorable heat dissipation of electronic devices, etc.

Inactive Publication Date: 2018-02-27
苏州柯仕达电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermally conductive silicone grease with insulation and low contact thermal resistance, adding a coupling agent; the thermally conductive silicone grease obtained by this method is a thermally conductive silicone grease product with a high thermal conductivity system, insulation and thermal contact resistance, adding a coupling agent can reduce The viscosity of the system, but the viscosity of the thermally conductive silicone grease obtained after mixing evenly is close to 350,000 centipoise, and the viscosity is still very high. The surface wettability of the thermally conductive silicone grease is poor, which leads to an increase in the thermal resistance of the section and the deterioration of the overall thermal conductivity, which is not conducive to Heat dissipation between electronic components

Method used

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  • Heat conduction silicone grease as well as processing method and application thereof
  • Heat conduction silicone grease as well as processing method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A processing method of thermally conductive silicone grease, such as figure 1 shown, including the following steps:

[0037] Step 1: Add the calcium carbonate powder into the gas phase silica gel for grinding and stirring. The grinding time is more than 2 hours. The particle size of the calcium carbonate powder is between 0.3-0.6 μm. In this embodiment, a smaller calcium carbonate powder is used to control the particle size. The diameter is between 0.3-0.4 μm.

[0038] Step 2: Add one or more of polyvinyl alcohol, hexamethyldisiloxane, tetraethyl silicate, ethyl silicate, and tetraethoxysilane, and keep stirring.

[0039] Step 3: Pour simethicone and methyl silicone oil slowly and keep stirring.

[0040] Step 4: Vacuumizing and defoaming treatment, control the temperature in this link to 35-40°C, and control the temperature to 35°C in this embodiment.

[0041] Step 5: Add coupling agent, thermally conductive filler and additives to it, and keep stirring;

[0042] St...

Embodiment 2

[0045] A processing method of thermally conductive silicone grease, such as figure 1 shown, including the following steps:

[0046] Step 1: Add the calcium carbonate powder into the gas phase silica gel for grinding and stirring. The grinding time is more than 2 hours. The particle size of the calcium carbonate powder is between 0.3-0.6 μm. In this embodiment, a smaller calcium carbonate powder is used to control the particle size. The diameter is between 0.5-0.6 μm.

[0047] Step 2: Add one or more of polyvinyl alcohol, hexamethyldisiloxane, tetraethyl silicate, ethyl silicate, and tetraethoxysilane, and keep stirring.

[0048] Step 3: Pour simethicone and methyl silicone oil slowly and keep stirring.

[0049] Step 4: Vacuumizing and defoaming treatment, controlling the temperature in this link to 35-40°C, and controlling the temperature to 40°C in this embodiment.

[0050] Step 5: Add coupling agent, thermally conductive filler and additives to it, and keep stirring;

[...

Embodiment 3

[0054] A processing method of thermally conductive silicone grease, such as figure 1 shown, including the following steps:

[0055] Step 1: Add the calcium carbonate powder into the gas phase silica gel for grinding and stirring. The grinding time is more than 2 hours. The particle size of the calcium carbonate powder is between 0.3-0.6 μm. In this embodiment, a smaller calcium carbonate powder is used to control the particle size. The diameter is between 0.4-0.5 μm.

[0056] Step 2: Add one or more of polyvinyl alcohol, hexamethyldisiloxane, tetraethyl silicate, ethyl silicate, and tetraethoxysilane, and keep stirring.

[0057] Step 3: Pour simethicone and methyl silicone oil slowly and keep stirring.

[0058] Step 4: Vacuumizing and defoaming treatment, control the temperature in this link to 35-40°C, and control the temperature to 38°C in this embodiment.

[0059] Step 5: Add coupling agent, thermally conductive filler and additives to it, and keep stirring;

[0060] St...

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Abstract

The invention relates to heat conduction silicone grease as well as a processing method and application thereof. The heat conduction silicone grease is prepared from substances of simethicone, heat conduction filling materials, coupling agents, auxiliary agents, methylsilicone oil, gas phase silicone and the like. In the prior art, when the heat conduction silicone grease with high viscosity is used, a surface coating method is generally used, i.e., a thick layer of heat conduction silicone grease coats on the surface of an electronic device; then, a heat radiation fin is adhered onto the heatconduction silicone grease. By using the operation mode, the consumption of the heat conduction silicone grease is great; in addition, pores can be easily generated between the heat radiation fin andthe heat conduction silicone grease. When the heat conduction silicone grease provided by the scheme is used, the heat conduction silicone grease can be dripped into the electronic device; then, theheat radiation sheet can be adhered onto the heat conduction silicon grease by force; the viscosity of the heat conduction silicone grease is low, and the flowability is good, so that during the adhesion on the heat radiation fin by force, the heat conduction silicone grease completely fits the shape of the two opposite sides of the heat radiation fin and the electronic device; the heat radiationeffect reduction due to pore remaining between the heat radiation fin and the electronic device can be avoided.

Description

technical field [0001] The invention relates to a processing method of heat-conducting silicone grease, in particular to a heat-conducting silicone grease and its processing method and application. Background technique [0002] Thermally conductive silicone grease is also called heat dissipation paste, which is a paste-like heat dissipation material containing silicone oil; due to the limitations of the manufacturing process and clamping method, there are always milling holes between the components and the heat sink, and the gaps are filled with air, and the air It is a poor conductor of heat, and the thermal conductivity of air is very low, which seriously affects the overall heat dissipation effect of electronic components. Filling the gap between the component and the heat sink with thermal conductive silicone grease can ensure the close contact between the component and the heat sink, increase the contact area, improve the heat transfer efficiency, and spread the heat ge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L29/04C08K13/04C08K7/24C08K7/06C08K13/02C08K3/04C08K3/22C08K3/28C08K3/38C08K3/36C09K5/14
CPCC08K2003/2227C08K2003/2296C08K2003/385C08K2201/011C08L83/04C08L2203/20C08L2205/025C08L2205/03C09K5/14C08L29/04C08K13/04C08K7/24C08K7/06C08K13/02C08K3/04C08K3/22C08K3/28C08K3/38C08K3/36
Inventor 李春方马鑫贾静波
Owner 苏州柯仕达电子材料有限公司
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