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Cu/W composite material with anisotropic property and preparation method thereof

An anisotropic, composite material technology, applied in the field of Cu/W composite materials, can solve the problem of not being able to fully exert the performance of packaging materials, and achieve the effects of high density, easy industrial amplification, and simple technical process

Active Publication Date: 2018-02-27
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the packaging materials currently used are all isotropic, and the performance of the packaging materials cannot be fully utilized

Method used

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  • Cu/W composite material with anisotropic property and preparation method thereof

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Effect test

Embodiment 1

[0024] A method for preparing an anisotropic Cu / W composite material, the preparation process comprising the following steps:

[0025] In the first step, tungsten fibers with a fiber diameter of 25 μm are non-woven weaved to obtain a tungsten fiber mat with a porosity of 30%.

[0026] Step 2. According to the geometric dimensions of the tungsten fiber felt, 0.45 times the volume of the tungsten fiber felt is used as the volume of the copper plate. The length and width of the copper plate are the same as the tungsten fiber felt, and the required copper plate thickness is calculated accordingly.

[0027] Step 3, the two layers of tungsten fiber felt obtained in step 1 and the copper plates of step 2 are stacked together alternately (such as figure 1 ), placed in a sintered boat made of ceramic material, raised to 1200°C in an argon protective atmosphere, then raised the pressure of argon in the furnace to 2 MPa, and kept it warm for 2 hours, then cooled to room temperature with ...

Embodiment 2

[0030] A method for preparing an anisotropic Cu / W composite material, the preparation process comprising the following steps:

[0031] In the first step, tungsten fibers with a fiber diameter of 50 μm are non-woven weaved to obtain a tungsten fiber mat with a porosity of 40%.

[0032] Step 2. According to the geometric dimensions of the tungsten fiber felt, 0.5 times the volume of the tungsten fiber felt is used as the volume of the copper plate. The length and width of the copper plate are the same as the tungsten fiber felt, and the required copper plate thickness is calculated accordingly.

[0033] Step 3, the two layers of tungsten fiber felt obtained in step 1 and the copper plates of step 2 are stacked together alternately (such as figure 1 ), placed in a sintered boat made of ceramic material, and heated up to 1300°C in an argon protective atmosphere, then the argon pressure in the furnace body was raised to 1.5MPa, and kept for 1 hour, then cooled to room temperature w...

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Abstract

The invention belongs to the field of metal composite materials and particularly relates to a preparation method of a Cu / W composite material with the anisotropic property. The preparation method provided by the invention comprises the following steps that wolfram fibers are subjected to non-woven manufacturing to obtain a wolfram fiber mat layer; a copper plate or a copper plate layer and the wolfram fiber mat layer are manufactured into a pre-sintered blank, wherein the copper plate layer is formed by a blank which is formed through copper powder; and in an argon protective atmosphere, the temperature is increased till the infiltration sintering temperature reaches, then the argon pressure is increased to 0.5-2MPa, heat preservation is conducted for 0.5-2 h, then cooling is conducted till the room temperature reaches, and the Cu / W composite material with the anisotropic property is obtained. According to the Cu / W composite material prepared through the method, the property can be adjusted, and the Cu / W composite material has the characteristics that the thermal expansion coefficient on the XY plane is small, and the thermal conductivity is high in the Z-axis direction, and the Cu / W composite material is particularly suitable for preparation of electronic packaging materials.

Description

technical field [0001] The invention belongs to the field of inorganic non-metallic materials, in particular to a Cu / W composite material with anisotropic properties. Background technique [0002] Metal tungsten (W) has a high melting point, high density, low thermal expansion coefficient and high strength, and metal copper (Cu) has good thermal conductivity and electrical conductivity. The Cu / W composite material combines the advantages of W and Cu, and can prepare an electronic packaging material with good thermal conductivity, appropriate thermal expansion coefficient and high strength. [0003] Cu / W composite materials are generally prepared by powder metallurgy, and the commonly used methods include infiltration, liquid phase sintering, and activation sintering. These traditional preparation methods have the characteristics of simple process and easy to achieve large-scale production, but the Cu / W composite materials prepared by these methods usually have a small amoun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C47/14C22C49/14C22C111/02
CPCC22C47/14C22C49/14
Inventor 张善伟林文松曹晓莹姚佳
Owner SHANGHAI UNIV OF ENG SCI
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