Single-component high thermal conductivity composite interfacial material with function of solving oil permeation by means of molecular sieve, and preparation method of composite interfacial material

An interface material, high thermal conductivity technology, applied in the field of thermal conductivity interface material, single-component thermal conductivity composite interface material and its preparation, high thermal conductivity composite interface material, can solve the problem of oil seepage, pollution of electronic components, failure of electronic components and other problems, to achieve the effect of low oil seepage length, prolong service life and increase filling volume

Inactive Publication Date: 2018-03-23
苏州创励新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, most of the thermal interface materials used on a large scale have oil leakage greater than 2mm. Under the existing powder system and production process conditions, the oil leakage problem is difficult to solve
Excessive oil leakage will pollute electronic components and eventually lead to failure of electronic components

Method used

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  • Single-component high thermal conductivity composite interfacial material with function of solving oil permeation by means of molecular sieve, and preparation method of composite interfacial material

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Embodiment Construction

[0037] Specific embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented in other different ways, that is, various modifications and changes can be made without departing from the disclosed scope of the present invention.

[0038] The high thermal conductivity composite interface material in the present invention is a composite interface material with a guiding thermal coefficient ≥ 5W / (m·K).

[0039] A single-component high thermal conductivity composite interface material with molecular sieves to improve oil leakage, including organic silicon polymers, thermal conductivity powders and additives, and the percentage of each component in the total weight of the high thermal conductivity composite interface material is: the organic 5-45% of silicon polymer,...

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Abstract

The invention discloses a single-component high thermal conductivity composite interfacial material with a function of solving oil permeation by means of a molecular sieve, and a preparation method ofthe composite interfacial material. The high thermal conductivity composite interfacial material is prepared from the following components by weight percent: 5-45% of an organosilicon polymer, 50-90%of heat conduction powder and 0.1-5% of additives, wherein the heat conduction powder is prepared from metallic oxide, and the metallic oxide is aluminum oxide with a particle size of 1-60mu m; during preparation, the zeolite molecular sieve is mixed with the organosilicon polymer in advance. By utilizing the moisture and water absorption performance of the added zeolite molecular sieve, the single-component high thermal conductivity composite interfacial material solves the problem of oil permeation.

Description

technical field [0001] The invention relates to a high heat conduction composite interface material, in particular to a single-component heat conduction composite interface material capable of improving oil seepage performance and a preparation method thereof, belonging to the field of heat conduction interface materials and heat dissipation technologies in the electronics industry. Background technique [0002] Heat dissipation has always been a key research task in the electronics industry, and the actual operating temperature of electronic components is one of the key factors affecting their reliability. With the development of electronic equipment towards miniaturization and high power consumption, its power consumption density gradually increases. The calorific value of electronic equipment has also increased exponentially, which also puts forward higher requirements on the heat dissipation performance of the system. [0003] The thermal interface material is the key m...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 谷长栋赵固
Owner 苏州创励新材料科技有限公司
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