Liquid cooling-air-cooling heat radiation combined intelligent server cabinet and control method thereof

An intelligent server, liquid cooling and heat dissipation technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. Air passage and other issues, to achieve energy saving and good heat dissipation effect, improve air flow efficiency and heat exchange efficiency, and reduce space

Pending Publication Date: 2018-04-24
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no clear air channel and intelligent control system in this invention, and at the same time, it cannot be uniformly processed for most liquid cooling solutions
[0007] Patent 201410357779.2 proposes a liquid-cooled and heat-dissipating server cabinet, including a casing, a server board, a heat sink, a heat pipe, a heat pipe, a heat exchanger, and a micro-liquid pump. Each of the server boards is installed with a corresponding The heat dissipation plate described above, the heat dissipation pipe is installed on the heat dissipation plate, the liquid pump and the heat exchanger are connected through the heat dissipation pipe, the heat exchange liquid flows in the heat dissipation pipe and the heat dissipation pipe, and the cabinet is only For cabinets that use similar water-cooled panels, it is not possible to use external circulation block air cooling, and there is no intelligent control system for single cabinets

Method used

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  • Liquid cooling-air-cooling heat radiation combined intelligent server cabinet and control method thereof
  • Liquid cooling-air-cooling heat radiation combined intelligent server cabinet and control method thereof
  • Liquid cooling-air-cooling heat radiation combined intelligent server cabinet and control method thereof

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Experimental program
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Effect test

Embodiment 1

[0053] like Figure 1 to Figure 7 As shown, an intelligent server cabinet combining liquid cooling and air cooling and heat dissipation includes an outer cabinet 1 and an inner cabinet 6, the inner cabinet 6 is located inside the outer cabinet 1, and several servers 2 are arranged in the inner cabinet 6 , each server 2 is respectively provided with a liquid cooling device 201, and each liquid cooling device 201 is respectively provided with a liquid inlet and a liquid outlet, and a main power supply is provided between the inner cabinet 6 and the outer cabinet 1 The liquid pipeline 7 and the main liquid return pipeline 8, all liquid inlets are respectively connected to the main liquid supply pipeline 7, and all liquid outlets are respectively connected to the main liquid return pipeline 8, and the main liquid supply pipeline 7 is provided with There is a water pump 10, and one end of the main liquid supply pipeline 7 and the main liquid return pipeline 8 extends out of the out...

Embodiment 2

[0061] The main structure of this embodiment is the same as that of Embodiment 1, and the similarities will not be repeated here. The difference is that: Figure 10 , Figure 11 As shown, the top of the inner cabinet 6 is provided with a baffle, and the fan 3 and the water-cooled heat exchanger 4 are arranged on the side of the inner cabinet 6 . The air-cooling passage is through the inner cabinet 6 through the fan wall 5, and the inner cabinet 6 and the outer cabinet 1 are located on the side of the liquid pipeline and the main liquid return pipeline 8, and the air flows to the inner cabinet 6 along the air-cooling passage. The two sides flow, and then flow from both sides of the inner cabinet 6 to the fan wall 5 and then enter the interior of the inner cabinet 6 . like Figure 10 or as Figure 11 As shown, the difference from Embodiment 1 is that the hot air channel position of the air-cooling channel is not the upper part of the inner cabinet 6, but the side area 114 of ...

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PUM

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Abstract

The invention relates to a liquid cooling-air-cooling heat radiation combined intelligent server cabinet comprising an outer cabinet and an inner cabinet arranged in the outer cabinet; a plurality ofservers are arranged in the inner cabinet; a liquid cooling heat radiation unit is arranged in each sever, and respectively provided a liquid inlet and a liquid outlet; a main liquid supply pipe and amain liquid return pipe are arranged between the inner cabinet and the outer cabinet; all liquid inlets are respectively connected with the main liquid supply pipe; all liquid outlets are respectively connected with the main liquid return pipe; the main liquid supply pipe is provided with a water pump; one ends of the main liquid supply pipe and the main liquid return pipe extend outside the outer cabinet and are connected with an external pipe; an air cooling channel and the liquid cooling pipe are arranged in the cabinet, thus solving the problems that existing most data centers have no standard cabinet when employing liquid cooling; in addition, the air cooling channel is reserved, thus leaving enough design space for many liquid cooling solutions.

Description

technical field [0001] The invention relates to the field of server heat dissipation, in particular to an intelligent server cabinet combining liquid cooling and air cooling for heat dissipation and a control method thereof. Background technique [0002] With the increasing integration of semiconductors and the increasing performance of chips, heat dissipation has become a new bottleneck for electronic equipment. Especially for the data center, the so-called data center refers to the place where computer equipment, server equipment, network equipment, storage equipment and other equipment are stored. Its function is to realize the centralized processing, storage, transmission, exchange and management of information. The energy consumption is huge, and nearly half of the energy consumption of the current data center is heat dissipation. Therefore, realizing energy saving and reducing consumption is one of the problems faced by the data center. [0003] In addition, tradition...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20718H05K7/20763H05K7/208
Inventor 李勇刘嵩周文杰黄光文何柏林陈创新陈韩荫
Owner SOUTH CHINA UNIV OF TECH
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