LED chip insulating heat-conducting solid crystal glue and preparation method thereof

Abstract

The invention belongs to the technical field of adhesive, and in particular relates to LED chip insulating heat-conducting solid crystal glue and a preparation method thereof. The specially-made heat-conducting filling material is formed by mixing heat-conducting filling materials with different shapes such as a needle shape, a sheet shape or a spherical shape; the needle-shaped and spherical heat-conducing filling materials and a certain amount of connecting agent are premixed, so that the needle-shaped and spherical heat-conducing filling materials are mutually connected to form a certain three-dimensional structure; the certain three-dimensional structure as well as resin, a crosslinking agent, a catalyst, adhesive and the like are mixed, so that distance does not exist between the heat-conducting filling materials within a certain range, the heat-conducting coefficient is high, the use amount of the filling materials is small, influence on the viscosity of colloid is low, the adhesion performance is excellent, the heat-conducting coefficient can be obviously increased and the purpose of improving the conducting efficiency is fulfilled.

Description

technical field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to an insulating heat-conducting crystal-bonding adhesive for LED chips and a preparation method thereof. Background technique

[0002] Because LED lamps consume less energy than incandescent lamps and fluorescent lamps, have a longer lifespan, and can realize intelligent control, they have a very broad application market. According to incomplete statistics, my country's LED production capacity in 2010 was more than 70 billion yuan, and by 2013 it had increased by 7 times, and it has been widely used in various places such as industry, home, and office.

[0003] At present, in the application process of LED lights, part of the light energy of the chip will be converted into heat energy during the light-emitting process, so that the operating temperature of the chip is too high, forming a junction temperature phenomenon, which seriously affects the luminous flux and ser...

Examples

Embodiment 1

[0044] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include in parts by weight: 60 parts of polysiloxane resin containing vinyl organosilicon, 35 parts of hydrogen-containing silicone oil crosslinking agent, 0.3 parts of platinum catalyst Karstedt, nano 9 parts of titanium dioxide adhesive and 150 parts of special thermal conductive filler.

[0045] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0046] (1) Preparation of special thermally conductive filler

[0047] a. Add 100 parts of thermally conductive filler alumina (needle shape) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0048] b. Add 100 parts of thermally conductive filler hexagonal boron nitride (spherical) into the high-speed disperser, add 0.2 parts of linking agent, mix evenly, and store in airtight;

[0049] c. Add the alum...

Embodiment 2

[0052] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include, in parts by weight: 80 parts of polysiloxane resin containing vinyl organosilicon, 45 parts of hydrogen-containing silicone oil crosslinking agent, 0.2 parts of platinum catalyst Karstedt, nano 8 parts of titanium dioxide adhesive and 120 parts of special thermal conductive filler.

[0053] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0054] (1) Preparation of special thermally conductive filler

[0055] a. Add 50 parts of thermally conductive filler alumina (flaky) into the high-speed disperser, add 0.5 parts of linking agent, mix evenly, and store in airtight;

[0056] b. Add 100 parts of thermally conductive filler hexagonal boron nitride (spherical) into the high-speed disperser, add 0.2 parts of linking agent, mix evenly, and store in airtight;

[0057] c. Add the aluminum...

Embodiment 3

[0060] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include, in parts by weight: 40 parts of E51 bisphenol A epoxy resin, 40 parts of alicyclic epoxy resin, and 85 parts of methyltetrahydrophthalic anhydride , 0.2 parts of 2-methylimidazole catalyst, 5 parts of nano-titanium dioxide adhesive and 180 parts of special thermally conductive filler.

[0061] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0062] (1) Preparation of special thermally conductive filler

[0063] a. Add 100 parts of thermally conductive filler alumina (needle shape) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0064] b. Add 100 parts of thermally conductive filler alumina (spherical) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0065] c. Add the alumina (needle-sha...

technical field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to an insulating heat-conducting crystal-bonding adhesive for LED chips and a preparation method thereof. Background technique

[0002] Because LED lamps consume less energy than incandescent lamps and fluorescent lamps, have a longer lifespan, and can realize intelligent control, they have a very broad application market. According to incomplete statistics, my country's LED production capacity in 2010 was more than 70 billion yuan, and by 2013 it had increased by 7 times, and it has been widely used in various places such as industry, home, and office.

[0003] At present, in the application process of LED lights, part of the light energy of the chip will be converted into heat energy during the light-emitting process, so that the operating temperature of the chip is too high, forming a junction temperature phenomenon, which seriously affects the luminous flux and ser...

Examples

Embodiment 1

[0044] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include in parts by weight: 60 parts of polysiloxane resin containing vinyl organosilicon, 35 parts of hydrogen-containing silicone oil crosslinking agent, 0.3 parts of platinum catalyst Karstedt, nano 9 parts of titanium dioxide adhesive and 150 parts of special thermal conductive filler.

[0045] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0046] (1) Preparation of special thermally conductive filler

[0047] a. Add 100 parts of thermally conductive filler alumina (needle shape) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0048] b. Add 100 parts of thermally conductive filler hexagonal boron nitride (spherical) into the high-speed disperser, add 0.2 parts of linking agent, mix evenly, and store in airtight;

[0049] c. Add the alum...

Embodiment 2

[0052] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include, in parts by weight: 80 parts of polysiloxane resin containing vinyl organosilicon, 45 parts of hydrogen-containing silicone oil crosslinking agent, 0.2 parts of platinum catalyst Karstedt, nano 8 parts of titanium dioxide adhesive and 120 parts of special thermal conductive filler.

[0053] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0054] (1) Preparation of special thermally conductive filler

[0055] a. Add 50 parts of thermally conductive filler alumina (flaky) into the high-speed disperser, add 0.5 parts of linking agent, mix evenly, and store in airtight;

[0056] b. Add 100 parts of thermally conductive filler hexagonal boron nitride (spherical) into the high-speed disperser, add 0.2 parts of linking agent, mix evenly, and store in airtight;

[0057] c. Add the aluminum...

Embodiment 3

[0060] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include, in parts by weight: 40 parts of E51 bisphenol A epoxy resin, 40 parts of alicyclic epoxy resin, and 85 parts of methyltetrahydrophthalic anhydride , 0.2 parts of 2-methylimidazole catalyst, 5 parts of nano-titanium dioxide adhesive and 180 parts of special thermally conductive filler.

[0061] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0062] (1) Preparation of special thermally conductive filler

[0063] a. Add 100 parts of thermally conductive filler alumina (needle shape) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0064] b. Add 100 parts of thermally conductive filler alumina (spherical) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0065] c. Add the alumina (needle-sha...

Images