LED chip insulating heat-conducting solid crystal glue and preparation method thereof

Abstract

The invention belongs to the technical field of adhesive, and in particular relates to LED chip insulating heat-conducting solid crystal glue and a preparation method thereof. The specially-made heat-conducting filling material is formed by mixing heat-conducting filling materials with different shapes such as a needle shape, a sheet shape or a spherical shape; the needle-shaped and spherical heat-conducing filling materials and a certain amount of connecting agent are premixed, so that the needle-shaped and spherical heat-conducing filling materials are mutually connected to form a certain three-dimensional structure; the certain three-dimensional structure as well as resin, a crosslinking agent, a catalyst, adhesive and the like are mixed, so that distance does not exist between the heat-conducting filling materials within a certain range, the heat-conducting coefficient is high, the use amount of the filling materials is small, influence on the viscosity of colloid is low, the adhesion performance is excellent, the heat-conducting coefficient can be obviously increased and the purpose of improving the conducting efficiency is fulfilled.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an insulating heat-conducting crystal-bonding adhesive for LED chips and a preparation method thereof. Background technique [0002] Because LED lamps consume less energy than incandescent lamps and fluorescent lamps, have a longer lifespan, and can realize intelligent control, they have a very broad application market. According to incomplete statistics, my country's LED production capacity in 2010 was more than 70 billion yuan, and by 2013 it had increased by 7 times, and it has been widely used in various places such as industry, home, and office. [0003] At present, in the application process of LED lights, part of the light energy of the chip will be converted into heat energy during the light-emitting process, so that the operating temperature of the chip is too high, forming a junction temperature phenomenon, which seriously affects the luminous flux and ser...

AI Technical Summary

Problems solved by technology

Conductive silver glue, as the name suggests, is mainly used for heat conduction and electricity conduction, often used in vertical structures, and can also be used in horizontal structures, but there is a hidden danger of leakage in large-scale applications; insulating die-bonding glue can be used for heat conduction, mainly used in horizontal structures

At present, the thermally conductive fillers of insulating die-bonding adhesives are mainly alumina, aluminum nitride, and boron nitride, etc., and their thermal conductivity is mostly concentrated in the range of 50-200W / (M K). The thermal conductivity is concentrated at 0.3-0.5W / (M K), and the thermal conductivity is low, but if too much thermal conductive filler is added, although the thermal conductivity of the insulating die-bonding adhesive can be improved, its viscosity is relatively high and the adhesive force decreases , restricting its application effect

[0006] The general method of using thermally conductive fillers is to directly mix them with resins, crosslinking agents, catalysts, adhesives, etc., and disperse them evenly under high-speed stirring. The material is evenly dispersed, but in the microscopic state, there is still a distance between the thermally conductive fillers, and the resin matrix is ​​full, and the heat conduction efficiency is poor. Although the amount of thermally conductive filler can be added to shorten the distance between the filler and the filler, to increase The purpose of conduction efficiency, but it will be restricted by the overall viscosity of the colloid, resulting in a limited amount of thermally conductive fillers. Therefore, the thermal conductivity of insulating die-bonding adhesives is generally different from that of thermally conductive fillers.

[0007] To sum up, the existing insulating die-bonding adhesives have low thermal conductivity. Since there is no suitable thermally conductive filler, when the insulating die-bonding adhesive is added with too much thermally conductive filler, although it can improve the thermal conductivity of the insulating die-bonding adhesive system, but its viscosity is relatively high, and the adhesive force decreases, which restricts its application effect

Images