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IC support plate

A carrier board and substrate technology, applied in coatings, circuit heating devices, anti-corrosion coatings, etc., can solve the problem of difficult heat dissipation of IC carrier boards, and achieve excellent salt spray resistance, excellent flame retardancy, and good adhesion and bonding Effect

Inactive Publication Date: 2018-05-01
杜桂萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a new type of IC carrier board, which provides assistance to the second IC substrate through a flexible circuit board, and finally implements it on the first IC substrate. This device is more novel in use; The setting of the structure effectively solves the problem that the IC carrier board is difficult to dissipate heat, and the IC carrier board is well protected by the protective coating to solve the problems raised in the above-mentioned background technology

Method used

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Embodiment 1

[0020] A kind of IC carrier board, it is characterized in that, comprises ceramic substrate 1, and described ceramic substrate is provided with first IC substrate 11, second IC substrate 12, flexible circuit board 13, and described first IC substrate is arranged on ceramic substrate In the central area, the second IC substrate is symmetrically arranged on both sides of the first IC substrate, and the flexible circuit board is symmetrically arranged on the upper and lower ends of the second IC substrate; layer 2, a second heat dissipation layer 3 is provided on one side of the first heat dissipation layer, an insulating layer 4 is provided on one side of the second heat dissipation layer, and a protective coating 5 is provided on the surface of the insulating layer.

[0021] Further, the first heat dissipation layer 2 is a metal copper heat dissipation layer.

[0022] Further, the second heat dissipation layer 3 is a phenolic fiber layer.

[0023] Further, the phenolic fiber l...

Embodiment 2

[0026] This embodiment provides an IC carrier with the same structure as in Embodiment 1, except that the protective coating 5 includes the following components in parts by weight: phenolic resin 23, cellulose acetate butyrate 13, acrylic resin 7. Azobisisobutyronitrile 6, polyethylene glycol 13, calcium stearate 11, sodium alginate 17, zinc hydride ferrite ceramic powder 19, tributyl phosphate 5, dodecyl alcohol ester 7, oxidation Gadolinium hollow microspheres 36, 2-methyl-1,5-pentanediamine 8, diethanolamine 15, distilled water 62.

[0027] The preparation method of the protective coating in the present embodiment is: the preparation method of the coating of the present invention is: phenolic resin, cellulose acetate butyrate, acrylic resin, azobisisobutyronitrile, polyethylene glycol, 2-methyl -1,5-Pentanediamine is dissolved and shaken well, and the shaken solution is heated to 55-65°C, and stirred at 150r / min for 45-65min to obtain a mixed solution; Disperse at a disper...

Embodiment 3

[0029] This embodiment provides an IC carrier with the same structure as in Embodiment 1, except that the protective coating 5 includes the following components in parts by weight: phenolic resin 34, cellulose acetate butyrate 21, acrylic resin 13. Azobisisobutyronitrile 13, polyethylene glycol 19, calcium stearate 17, sodium alginate 29, zinc hydride ferrite ceramic powder 48, tributyl phosphate 9, dodecyl alcohol ester 11, oxidation Gadolinium hollow microspheres 53, 2-methyl-1,5-pentanediamine 15, diethanolamine 24, distilled water 89.

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Abstract

The invention provides an IC support plate, which comprises a ceramic substrate, wherein the ceramic substrate is provided with a first IC substrate, second IC substrates and flexible circuit boards;the first IC substrate is arranged in a central region of the ceramic substrate; the second IC substrates are symmetrically arranged at two sides of the first IC substrate; and the flexible circuit boards are symmetrically arranged at the upper end and the lower end of each second IC substrate. The second IC substrates are provided with assistance through the flexible circuit board, and the IC support plate is finally implemented on the first IC substrate, so that the overall performance of the IC support plate is significantly improved; meanwhile, the problem that the IC support plate is difficult to cool is effectively solved through the arrangement of a cooling structure of the IC support plate; and furthermore, each protective coating and a corresponding insulating layer have good adhesive binding force, the IC support plate has excellent fire resistance and salt fog resistance at the same time and the internal structure of the IC support plate can be effectively protected.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to an IC carrier board. Background technique [0002] At present, the substitutes of my country's printed circuit board industry are mainly manifested in the substitution of sub-industry products, the market share of rigid circuit boards has shrunk, and the market share of flexible circuit boards has continued to expand. The development of high-density electronic products will inevitably lead to higher levels and smaller BGA hole spacing, which also puts forward higher requirements for the heat resistance of materials. In the current strategic transformation period of industrial chain integration and collaborative development and innovation, high-density circuit boards, new functions and intelligence of circuit boards, and the development of light, thin, thin and small products bring about heat dissipation, precise layout, and packaging design. etc. h...

Claims

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Application Information

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IPC IPC(8): H05K1/02C09D161/06C09D101/14C09D133/00C09D171/02C09D105/04C09D7/61C09D7/63C09D5/18C09D5/08
CPCH05K1/0209C08L2205/035C09D5/08C09D5/18C09D161/06C08L1/14C08L33/00C08L71/02C08L5/04C08K13/04C08K7/24C08K5/521C08K3/22C08K5/17
Inventor 杜桂萍
Owner 杜桂萍