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Gold-based conductive paste for silk-screen printing and preparation method of gold-based conductive paste

A conductor paste, screen printing technology, applied in cable/conductor manufacturing, printed circuits, metal pattern materials, etc., can solve the problem of not guaranteeing the existence of copper elements, and achieve obvious gold wire bonding performance, uniform copper elements, Improved uniformity and broadness

Inactive Publication Date: 2018-05-18
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper element is an important element to ensure the bonding strength of gold wire in gold conductor paste. Conventional gold conductor paste is added in the form of micron-sized copper powder or copper oxide. During the dispersion process, since it is a micron-sized powder, it cannot guarantee that each tiny Copper element is present in the unit

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0034] The preparation method of the gold-based conductive paste for screen printing is characterized in that it specifically comprises the following steps:

[0035] Step 1: add copper-containing organic matter and organic binder phase into an organic solvent, heat and dissolve, and make an organic carrier containing copper;

[0036] Step 2: mixing and stirring the gold powder particles, glass powder and the organic carrier obtained in step 1;

[0037] Step 3: Perform conventional rolling and filtering on the system obtained in Step 2 to obtain the gold-based conductor paste for screen printing.

Embodiment 1

[0039] 0.2 parts of copper formate and 7.8 parts of ethyl cellulose were dissolved in 10 parts of terpineol to prepare an organic vehicle, and 80 parts of gold powder and 2 parts of borosilicate zinc glass powder were added to the dissolved organic vehicle. The mixture was fully stirred with a stirrer, and dispersed with a three-roll mill to obtain gold-based conductor paste sample 1 for screen printing.

Embodiment 2

[0041] Dissolve 1 part of copper formate and 5 parts of ethyl cellulose in 10 parts of terpineol to prepare an organic vehicle, add 82 parts of gold powder and 2 parts of zinc borosilicate glass powder to the dissolved organic vehicle, and use a stirrer to The mixture was fully stirred and dispersed by a three-roll rolling mill to obtain gold-based conductor paste sample 2 for screen printing.

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Abstract

The invention relates to gold-based conductive paste for silk-screen printing and a preparation method of the gold-based conductive paste. The conductive paste comprises gold powder particles, glass powder and an organic carrier, wherein a copper element is contained in the organic carrier, and the copper element in the organic carrier exists in a form of organic copper. The gold-based conductivepaste for silk-screen printing, provided by the invention, has the following advantages that (1) the reliability of an electronic component and a wiring substrate is improved; 2) the bonding performance of a gold wire after sintering is obviously improved; and 3) the sintering smoothness of a surface of the gold-based conductor paste is improved.

Description

technical field [0001] The invention belongs to the technical field of conductive paste and its preparation method, and in particular relates to a conductive paste for screen printing using gold as a conductive material and a method for preparing the conductive paste. Background technique [0002] In the formation of wiring conductors such as electronic components and printed circuit boards / substrates, a method of using a conductive paste is known. From the viewpoint of ensuring high conductivity, silver paste mainly composed of silver Ag is used as a conductive paste. . However, the silver paste has a problem that ion migration, that is, electrolysis of silver tends to occur, thereby causing failures such as short circuits between wirings, and hindering the reliability of wiring boards. Therefore, for components with reliability requirements, a technique of using gold conductor paste with gold as the main component that is less prone to migration phenomenon instead of silv...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00H05K1/09
CPCH01B1/16H01B1/22H01B13/00H05K1/092
Inventor 张建益王要东党丽萍陆冬梅周宝荣王大林
Owner 西安宏星电子浆料科技股份有限公司
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