Electromagnetic shielding package structure with pin sidewall tin climbing function and its manufacturing process

Abstract

The invention relates to an electromagnetic shielding package structure having a pin side wall tin climbing function and a manufacturing process thereof. The structure comprises a paddle and pins, wherein each pin comprises a planar part and a side wall part, a chip is arranged on a front surface of the paddle, peripheral regions of the paddle, the pins and the chip are encapsulated with a first plastic package material, a first shielding layer is arranged on the first plastic package material, a second plastic package material is arranged on the first shielding layer, a second shielding layeris arranged on the second plastic package material, a third plastic package material is arranged on the second shielding layer, the side wall parts of a part of pins are higher than the first plasticpackage material and the second plastic package material and are electrically connected to the first shielding layer and the second shielding layer, and the side wall part of the other pins are lowerthan the first shielding layer. Pins are directly electroplated in grooves formed by etching of a support plate and are provided with protruding arcs and side walls, the side walls are connected to the arcs, protrude out of the plastic package materials and have certain heights, the electromagnetic shielding layer can be directly and electrically connected to the side walls of the pins to achievegrounding, a metal post or a conductive through hole is not additionally formed, so that the manufacturing cost and time are reduced.

Description

technical field [0001] The invention relates to an electromagnetic shielding packaging structure with the function of tin climbing on the side wall of pins and a manufacturing process thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] As the operation speed of electronic components and the frequency of transmission signals are getting higher and higher, because integrated circuits are prone to electromagnetic interference with other internal or external electronic components, such as crosstalk, transmission loss and signal reflection, etc., the operating performance of integrated circuits subject to cuts. Therefore, the requirements of electronic components for electromagnetic interference (EMI) protection are also constantly improving. How to protect the chip in the semiconductor package from electromagnetic interference is very important. [0003] One way to reduce EMI is to shield the semiconductor package. For example, ...

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Problems solved by technology

[0004] However, the above-mentioned electromagnetic shielding method is more difficult when grounding the shielding layer, and it needs to form metal posts on the substrate (see figure 1 ), electronic components, or through the TSV process to form via holes on the molding compound and then fill metal fillers to form via columns. No matter which method requires additional processes, it increases manufacturing costs and time

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