Metal housing and manufacturing method thereof

A manufacturing method and metal technology, applied in the direction of metal shell, metal material coating process, pressure inorganic powder coating, etc., can solve the problems of resistance increase and other problems, solve the problem of conductivity, not easy to wear and oxidize, and avoid the decline of conductivity Effect

Pending Publication Date: 2018-05-25
HUAWEI MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a metal casing and its manufacturing method, to solve the problem of increased resistance of the electrical connection contacts on the metal casing during use, and to improve the conduction performance of the metal casing when it is used as an antenna

Method used

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  • Metal housing and manufacturing method thereof
  • Metal housing and manufacturing method thereof
  • Metal housing and manufacturing method thereof

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Embodiment Construction

[0072] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0073] figure 2 It is a flowchart of a metal casing manufacturing method provided by an embodiment of the present invention. Such as figure 2 As shown, the method includes the following steps:

[0074] S1. Processing the metal base material into a casing with a preset structure.

[0075] The preset structure of the above casing is determined by the type of the metal casing. The metal casing described in the embodiment of the present invention can be any type of...

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Abstract

The invention discloses a metal housing and a manufacturing method thereof. According to the invention, a metal thin layer is deposited in an electrical connection contact area on a shell of the metalhousing, and the abrasion resistance and corrosion resistance of the metal thin layer are higher than that of a metal base material adopted by the shell, so that the metal thin layer is exposed at anelectrical connection contact in the actual using process, the high abrasion resistance and high corrosion resistance of the metal thin layer can avoid repeated friction between the electrical connection contact and a metal elastic piece on a mainboard of electrical equipment to generate particles, and thus the conductivity of the electrical connection contact is avoided from being affected by oxidation and accumulation of the particles. Compared with a mode of fixing a metal sheet on the electrical connection contact through laser welding, ultrasonic welding or screws in the prior art, the deposited metal thin layer in the embodiment of the invention is not limited by the space of an inner cavity of the shell and can be implemented on any sizes of electrical connection contacts, so thatthe embodiment of the invention can fundamentally solve a conductive problem of the electrical connection contact on the metal housing.

Description

technical field [0001] The invention relates to the technical field of electronic equipment manufacturing, in particular to a metal casing and a manufacturing method thereof. Background technique [0002] At present, most electronic devices use metal casings to use the metal casing as an antenna or a part of the antenna, thereby reducing the space occupied by the antenna, which is conducive to the miniaturization and ultra-thinning of electronic devices, and is more convenient for users to carry. . [0003] Figure 1A It is a schematic diagram of a partial structure of the inner cavity of a metal casing of an existing electronic device, Figure 1B It is a schematic diagram of a partial structure of a motherboard of an electronic device. refer to Figure 1A , there are usually more than a dozen electrical connection contacts in the inner cavity of the metal casing, including the areas marked by labels 111-115; correspondingly, refer to Figure 1B , the main board is provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/04C23C28/02
CPCH05K5/04C23C28/023C23C24/04C23C4/08C23C4/02H01Q1/243H01Q1/38C25D11/18C23C22/82C22F1/04C23C14/02C23C14/16C23C24/00C25D11/16
Inventor 柯有和王永祥蔡明马戎
Owner HUAWEI MACHINERY
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