Method, system and device for eliminating influence on photocuring by oxygen and photocuring equipment

Abstract

The invention discloses a method, a system and a device for eliminating influence on photocuring by oxygen and photocuring equipment. The method comprises the following steps: first gas is filled in acavity; when the oxygen in the cavity is detected to be lower than a preset value, the first gas is stopped from filling in the cavity, and meanwhile, second gas is filled above a working plane in the cavity; the first gas and the second gas are both gas capable of eliminating influence on the photocuring reaction process by the oxygen; and the second gas is lower in filling flow value compared with the first gas. In the method, the system and the device for eliminating the influence on photocuring by the oxygen and the photocuring equipment, the oxygen is totally eliminated to the greatest extent through filling of the first gas with higher flow value; and in subsequent working process, the second gas with lower flow value is directly filled above the working plane in the cavity to prevent the oxygen from influencing the surfaces of photosensitive resins, so that the photocuring effect is guaranteed, nitrogen is fully used, and meanwhile, the use level of the nitrogen is saved.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to a method, system, device and photocuring equipment for eliminating the influence of oxygen on photocuring. Background technique [0002] Light-curing rapid prototyping, commonly known as SLA technology, uses photosensitive resin as the raw material, and controls the laser to scan point by point on the surface of the liquid photosensitive resin according to the layered section information of the part through computer control. The resin in the scanned area is thin The layer is cured by photopolymerization to form a thin layer of the part. After one layer is cured, the workbench is moved down by a layer thickness, and then a new layer of liquid resin is applied on the surface of the previously cured resin until a three-dimensional solid model is obtained. Because SLA technology causes polymer chemical reactions to occur inside the material, its forming di...

AI Technical Summary

Problems solved by technology

[0003] In the photocuring molding technology of the prior art, due to exposure to air during the photocuring reaction, the oxygen in the air is very easy to combine with free radicals to form oxygen inhibition, which leads to the curing of the bottom layer of the cured layer, and the surface is not cured and sticky. Phenomenon

In order to solve this technical problem, that is, reduce the influence caused by oxygen inhibition as much as possible, at present, there is a way to continuously fill the cavity with a large flow rate of nitrogen gas. The cavity is continuously filled with a large flow of nitrogen gas. Therefore, as the working time of the equipment increases, more and more nitrogen gas is required, which greatly increases the cost of the light curing equipment.

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