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Low-temperature resistant epoxy resin material and preparation method thereof

An epoxy resin and low-temperature-resistant technology, which is applied in the field of low-temperature-resistant epoxy resin materials and preparations, can solve the problem that the low-temperature resistance of epoxy resin cannot be improved, and the impact and stress resistance cannot be improved, and the impact and stress resistance can not be improved. Poor and other problems, to achieve the effect of increasing the upper limit use temperature, good low temperature toughening effect, and good ultra-low temperature toughness

Active Publication Date: 2018-05-29
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy resin is widely used in aerospace, machinery and other industrial fields due to its excellent bonding performance, heat resistance, corrosion resistance, good mechanical properties, dimensional stability and manufacturability. The molecular chain has a three-dimensional cross-linked network structure, so there are disadvantages such as high brittleness, poor fatigue resistance, and poor impact toughness. , the effective means to solve this problem is to make the epoxy resin flexible. The flexible methods mainly include physical addition method and chemical modification method, or a combination of the two. The physical addition method is mainly to add toughening agent or plasticizer The chemical modification method is to modify the chemical structure of the curing agent or epoxy resin, but there are still problems in the existing prepared epoxy resin or its composite materials, which cannot maintain its high impact resistance and Defects in stress resistance limit its application in some fields
[0003] In the prior art, there are reports about adopting graphene to modify epoxy resin. Because the unique two-dimensional crystal structure of graphene endows it with excellent mechanical, thermal, optical, electrical and other properties, graphene has a good effect on epoxy resin. Modification can improve the dielectric properties, thermal stability and flame retardancy of epoxy resin, but in the above modification, the low temperature resistance of epoxy resin cannot be improved

Method used

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  • Low-temperature resistant epoxy resin material and preparation method thereof
  • Low-temperature resistant epoxy resin material and preparation method thereof
  • Low-temperature resistant epoxy resin material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Trifunctional cycloaliphatic epoxy resin 100 parts

[0032] 10 parts of polyaryl ether sulfone

[0033] Graphene 0.5 parts

[0034] Curing agent: 4,4'-diaminodiphenylmethane, the amount added is 30% of the mass of epoxy resin

[0035] Preparation Process:

[0036] The first step is to weigh a certain amount of epoxy resin and graphene according to the proportion, heat the epoxy resin to 120° C., add graphene, and stir for 10 hours to obtain a mixture 1.

[0037] In the second step, the mixture 1 was poured into an Erlenmeyer flask, put into an ultrasonic water pool, the temperature of the water bath was controlled at 80° C., and the ultrasonic vibration was performed for 4 hours to obtain the mixture 2.

[0038] The third step is to weigh a certain amount of poly(aryl ether sulfone) according to the proportion, heat the mixture 2 to 140°C, add poly(aryl ether sulfone) slowly, control the stirring speed at 600r / min, and stir vigorously for 100 minutes to make It is m...

Embodiment 2

[0042] Trifunctional epoxy resin TGAP 100 parts

[0043] 20 parts of polyaryl ether sulfone

[0044] Graphene 0.8 parts

[0045] Curing agent: 4,4'-diaminodiphenylmethane, the amount added is 30% of the mass of epoxy resin

[0046] Preparation Process:

[0047] The preparation process is the same as in Example 1. The tensile strength, impact strength, fracture toughness and glass transition temperature of low temperature resistant epoxy resin composites at liquid nitrogen temperature are shown in Table 1.

Embodiment 3

[0049] Bisphenol F type epoxy resin 100 parts

[0050] Polynaphthyl ether sulfone 23 parts

[0051] Curing agent: 4,4'-diaminodiphenylmethane, the addition amount is 30% of the mass of epoxy resin,

[0052] Graphene 0.7 parts

[0053] The preparation process is the same as in Example 1. The tensile strength, impact strength, fracture toughness and glass transition temperature of low temperature resistant epoxy resin composites at liquid nitrogen temperature are shown in Table 1.

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Abstract

The present invention provides a low-temperature resistant epoxy resin material and a preparation method thereof. The material is composed of epoxy resin, poly (phthalazinone ether sulfone), grapheneand a curing agent, and the graphene and the poly(phthalazinone ether sulfone) have a synergistic effect. The graphene regulates the phase separation degree of the poly (phthalazinone ether sulfone) and the epoxy resin in the solidification process, so that the phase structure of the composite material stays in a ''bicontinuous phase structure'' during the solidification process. Therefore, the epoxy resin composite material has good ultralow-temperature toughness; the graphene and the poly (phthalazinone ether sulfone) can achieve the synergistic effect by adjusting of distribution ratios andcontents of various groups, and the epoxy resin material with greatly-improved comprehensive low-temperature resistance can be obtained. The epoxy resin material has the advantages of high mechanicalproperties and excellent thermal stability at the liquid nitrogen temperature, and is easy to manufacture and process.

Description

technical field [0001] The invention relates to a low-temperature-resistant epoxy resin material and a preparation method, belonging to the technical field of composite materials. Background technique [0002] Epoxy resin is widely used in aerospace, machinery and other industrial fields due to its excellent bonding performance, heat resistance, corrosion resistance, good mechanical properties, dimensional stability and manufacturability. The molecular chain has a three-dimensional cross-linked network structure, so there are disadvantages such as high brittleness, poor fatigue resistance, and poor impact toughness. , the effective means to solve this problem is to make the epoxy resin flexible. The flexible methods mainly include physical addition method and chemical modification method, or a combination of the two. The physical addition method is mainly to add toughening agent or plasticizer The chemical modification method is to modify the chemical structure of the curin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L81/06C08K3/04C08G59/50
CPCC08G59/5033C08L63/00C08L2201/08C08L81/06C08K3/04
Inventor 刘思畅张涛陈磊嵇培军王国勇
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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