Lead-free red glue and preparation method thereof

Abstract

The invention discloses lead-free red glue and a preparation method thereof. The lead-free red glue is prepared from the following components in parts by weight: 45 to 53 parts of bisphenol A phenolicepoxy resin, 15 to 29 parts of polyketone resin, 3 to 10 parts of a curing agent, 9 to 11 parts of an accelerant, 42 to 53 parts of a toughening agent, 1 to 4 parts of white carbon black, 16.5 to 30.5 parts of a thixotropic agent, 3 to 27 parts of a plasticizer, 6 to 15 parts of a vulcanizing agent and 0.3 to 1.3 parts of pigment powder. The lead-free red glue disclosed by the invention has the advantages of scientific and reasonable components and safety and convenience for utilization; the bisphenol A phenolic epoxy resin, the polyketone resin, the curing agent, the an accelerant, the toughening agent, the white carbon black, the thixotropic agent, the plasticizer, the vulcanizing agent and the pigment powder are used as raw materials, one or more of dioctyl phthalate, dibutyl phthalateand dicapryl phthalate are used as the plasticizer so that the plastic performance of the red glue in a utilization process is improved; all raw materials for production and a whole production process do not contain a lead element, so that on one hand, injuries to human bodies are not caused; on the other hand, damages to the environment are not caused, so that the lead-free red glue is a productwhich is environmentally friendly and is easy to popularize.

Description

technical field [0001] The invention relates to the field of SMT materials, in particular to a lead-free red glue and a preparation method thereof. Background technique [0002] Red glue is a kind of polydilute compound, which is different from solder paste in that it solidifies after being heated, and its freezing point temperature is 150°C. At this time, red glue starts to change from paste to solid directly. Red glue belongs to SMT material. On the SMT stencil, the SMT stencil is also divided into solder paste net and red glue net. As the name implies, solder paste net is used for brushing solder paste, and red glue net is used for brushing red glue. Red glue net is generally used for plug-in comparison. On the many boards, after brushing the red glue, the components are pasted and then wave soldered uniformly, and the component soldering will be completed. [0003] The red gum currently on the market, in the preparation process, will add lead or lead-containing compound...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the existing defects and provide a lead-free red glue and its preparation method, which can effectively solve the problem that lead elements or compounds containing lead elements are added to the red glue in the background technology during the preparation process. , lead metal is a heavy metal, which will cause certain damage to the human body, and is not environmentally friendly, causing damage to the environment and causing lead pollution. In addition, during the use of red glue, there will be low curing effect, low adhesion strength and low plasticity. And the toughness is lower, which reduces the practicality of red glue

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